Implementation of Advanced Micro-Interconnection Technologies on a Thin-Film Multichip Module

The performance of multichip modules (MCM's) is ultimately governed by the signal propagation delay between its components. With both increasing 1/0 counts on dice and higher operating frequencies, it is critical to develop fine pitch interconnection techniques. Additionally, as multichip modules gain acceptance in commercial applications, it will be necessary to combine dice obtained from various sources on a single substrate. Such dice may have differing interconnection techniques. As part of ARPA's program for application-specific electronic modules, we have designed and built a thin film substrate that incorporates (solder) flip chip, wirebond, TAB and discrete components. In this abstract, we describe the unique interconnection aspects of the module. This includes the use of lasersonic bonding (LSB) to attach a fine (outer lead bond) pitch TAB die, a simultaneous wire microconnection technique that allows customizing the function of certain features on the module, and a top surface metallurgy compatible with the three most common interconnection technologies.