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引用次数: 12

摘要

提出了一种检测fpga中电阻性开路缺陷的新技术。该技术是基于fpga的可重构特性。使用这种技术,缺陷路径的延迟比无故障路径的延迟增加了几倍,即使在较低的测试速度下,fpga中电阻性开放缺陷的检测分辨率也更高。进行了各种详细的SPICE模拟来验证该方法。同时,给出了整个FPGA的测试组态生成方案。
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Testing for resistive open defects in FPGAs
This paper presents a new technique for detecting resistive open defects in FPGAs. This technique is based on the reconfigurability feature of FPGAs. Using this technique, the delay of a defective path is increased several times more than the delay of the fault-free path, resulting in a higher resolution in detectability of resistive open defects in FPGAs, even at lower tester speed. Various detailed SPICE simulations are performed to validate this method. Also, a test configuration generation scheme is presented for the entire FPGA.
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