应用失效分析工具和技术实现集成电路的信任和保证

Adam G. Kimura, Adam R. Waite, Jonathan Scholl, Glen D. Via
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引用次数: 2

摘要

传统的制造后测试可以可靠地验证IC是否正常工作,但它无法区分正品和假冒芯片之间的区别,也无法识别恶意设计更改。本文提出了一个基于FA工具和技术的IC分解工作流,它为零信任环境中的组件提供了可量化的保证级别。
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Applied Failure Analysis Tools and Techniques Toward Integrated Circuit Trust and Assurance
Traditional post-fabrication testing can reliably verify whether or not an IC is working correctly, but it cannot tell the difference between an authentic and counterfeit chip or recognize design changes made with malicious intent. This article presents an IC decomposition workflow, based on FA tools and techniques, that provides a quantifiable level of assurance for components in a zero trust environment.
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