面向产品级数据总线分析的基于矩量法的场求解器的减少耦合并行化技术

2007 IEEE Electrical Performance of Electronic Packaging Pub Date : 2007-11-21 DOI:10.1109/EPEP.2007.4387196

A. Hesford, J. Morsey, W. Chew, A. Deutsch, H.H. Smith

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引用次数: 1

摘要

提出了一种利用减耦法产生的稀疏阻抗矩阵的并行鲁棒分解算法。该算法允许快速模拟非常大的芯片和封装问题。一个典型的例子显示了一个宽的片上数据总线，它需要一百万个表面未知数和一个带有分布式内存的1024节点IBM BlueGene集群的计算能力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Parallelization of the Reduced-Coupling Technique for a Method-of-Moments-Based Field Solver Used for Product-Level Wide Data-Bus Analysis

A parallel LU decomposition algorithm is presented to take advantage of the sparse impedance matrix produced by the reduced-coupling method. This algorithm allows rapid simulation of very large chip and packaging problems. A representative example is shown for a wide, on-chip data-bus that required one million surface unknowns and the computational power of a 1024-node IBM BlueGene cluster with distributed memory.

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2007 IEEE Electrical Performance of Electronic Packaging

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