基于基板集成波导互连的双模高速数据传输

2007 IEEE Electrical Performance of Electronic Packaging Pub Date : 2007-11-21 DOI:10.1109/EPEP.2007.4387164

A. Suntives, R. Abhari

{"title":"基于基板集成波导互连的双模高速数据传输","authors":"A. Suntives, R. Abhari","doi":"10.1109/EPEP.2007.4387164","DOIUrl":null,"url":null,"abstract":"The enclosed volume by a substrate integrated waveguide interconnect is re-utilized to increase the channel capacity. A stripline is embedded inside the waveguide, thus a dual-mode or hybrid interconnect structure is created. Isolation and transmission characteristics of the two signal channels are evaluated by fullwave simulations. Measurements of the fabricated prototype demonstrate that the hybrid platform handles an aggregate data rate of 8.5 Gb/s.","PeriodicalId":402571,"journal":{"name":"2007 IEEE Electrical Performance of Electronic Packaging","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":"{\"title\":\"Dual-Mode High-Speed Data Transmission Using Substrate Integrated Waveguide Interconnects\",\"authors\":\"A. Suntives, R. Abhari\",\"doi\":\"10.1109/EPEP.2007.4387164\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The enclosed volume by a substrate integrated waveguide interconnect is re-utilized to increase the channel capacity. A stripline is embedded inside the waveguide, thus a dual-mode or hybrid interconnect structure is created. Isolation and transmission characteristics of the two signal channels are evaluated by fullwave simulations. Measurements of the fabricated prototype demonstrate that the hybrid platform handles an aggregate data rate of 8.5 Gb/s.\",\"PeriodicalId\":402571,\"journal\":{\"name\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"volume\":\"18 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-11-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"16\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2007.4387164\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2007.4387164","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 16

摘要

基片集成波导互连所封闭的体积被重新利用以增加通道容量。带状线嵌入在波导中，因此创建了双模或混合互连结构。通过全波仿真对两个信号通道的隔离性和传输特性进行了评价。样机的测试结果表明，混合平台的总数据速率可达8.5 Gb/s。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Dual-Mode High-Speed Data Transmission Using Substrate Integrated Waveguide Interconnects

The enclosed volume by a substrate integrated waveguide interconnect is re-utilized to increase the channel capacity. A stripline is embedded inside the waveguide, thus a dual-mode or hybrid interconnect structure is created. Isolation and transmission characteristics of the two signal channels are evaluated by fullwave simulations. Measurements of the fabricated prototype demonstrate that the hybrid platform handles an aggregate data rate of 8.5 Gb/s.

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2007 IEEE Electrical Performance of Electronic Packaging

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