InP晶圆位错的测量

Qi-jian Huang, Zhiguo Liu, R. Yang, Xiaolan Li, Qiang Wang, Xiuwei Tian, Jianye Yang, Shuai Li
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引用次数: 0

摘要

研究了HCl、H3PO4、HBr蚀刻剂、温度、光照对InP单晶位错凹坑显示的影响,并采用湿法化学蚀刻法分析了光照对InP单晶位错凹坑显示的影响。实验结果表明,蚀刻速率与混合蚀刻液中HBr的比例密切相关,单独使用HBr可以在InP晶片上显示位错坑。光照和较高的温度都能提高蚀刻速率。讨论了不同尺寸位错坑形成的机理。
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The measurement of dislocation on InP wafers
We studied the effect of HCl, H3PO4, HBr etchants, temperature, illumination on the display of dislocation pits on <;100> InP single crystal wafers, and analyzed the effect of illumination, using the wet chemical etching method. The experimental results show that the etching rate is strongly dependent on the proportion of HBr in the mixed etchant and HBr alone can reveal dislocation pits on <;100> InP wafers. Both illumination and higher temperature can increase the etching rate. We also discuss the mechanism of different sizes of dislocation pits.
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