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2013 International Conference on Indium Phosphide and Related Materials (IPRM)最新文献

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Monolithically integrated optical link using photonic crystal laser and photodetector 使用光子晶体激光器和光电探测器的单片集成光链路
Pub Date : 2013-07-18 DOI: 10.1109/ICIPRM.2013.6562618
S. Matsuo
We have demonstrated monolithic integration of photonic crystal (PhC) laser and photodetector. By employing an embedded active region structure, PhC laser exhibits ultra-low threshold current. Integrated optical link exhibits ultra-low operating energy of 28.5 fJ/bit.
我们展示了光子晶体(PhC)激光器与光电探测器的单片集成。通过采用嵌入式有源结构,PhC激光器具有超低阈值电流。集成光链路具有28.5 fJ/bit的超低工作能量。
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引用次数: 0
High transconductance surface channel In0.53Ga0.47As MOSFETs using MBE source-drain regrowth and surface digital etching 高跨导表面通道In0.53Ga0.47As mosfet的MBE源极漏极再生和表面数字蚀刻
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562630
Sanghoon Lee, Cheng-Ying Huang, A. Carter, J. Law, D. Elias, V. Chobpattana, B. Thibeault, W. Mitchell, S. Stemmer, A. Gossard, M. Rodwell
We demonstrate In0.53Ga0.47As surface channel MOSFETs using a gate-last process and MBE source/drain (S/D) regrowth. The structure uses a sacrificial N+ InGaAs channel cap layer between the regrown S/D contact layer and the channel, which is removed in the channel region by a “digital” etch process incorporating UV ozone oxidation and surface stripping in dilute HCl. A device with 65 nm-Lg and 1.2 nm EOT shows 1.6 mS/μm peak transconductance at Vds = 0.5 V and 120 mV/dec SS at Vds = 0.05 V, while 535 nm-Lg devices show 95 mV/dec SS at at Vds = 0.1 V.
我们演示了In0.53Ga0.47As表面沟道mosfet,使用栅末工艺和MBE源/漏极(S/D)再生。该结构在再生的S/D接触层和通道之间使用牺牲的N+ InGaAs通道帽层,通过“数字”蚀刻工艺结合紫外线臭氧氧化和稀HCl中的表面剥离在通道区域去除。65 nm- lg和1.2 nm EOT器件在Vds = 0.5 V时的跨导峰为1.6 mS/μm,在Vds = 0.05 V时的跨导峰为120 mV/dec,而535 nm- lg器件在Vds = 0.1 V时的跨导峰为95 mV/dec。
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引用次数: 14
120nm AlSb/InAs HEMT without gate recess: 290GHz fT and 335GHz fmax 120nm无栅极凹槽的AlSb/InAs HEMT: 290GHz fT和335GHz fmax
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562604
C. Gardès, S. Bagumako, L. Desplanque, N. Wichmann, S. Bollaert, F. Danneville, X. Wallart, Y. Roelens
In this paper, we report on high frequency performances of AlSb/InAs high electron mobility transistor (HEMT) with 120nm gate length at room temperature. The excellent combined cut-off frequencies fT/fmax of 290/335 GHz simultaneously obtained at drain bias of 0.36V is another demonstration of the ability of AlSb/InAs HEMT for high frequency operation with low-power consumption. Small-signal equivalent circuit parameters have been extracted.
本文报道了栅极长度为120nm的AlSb/InAs高电子迁移率晶体管(HEMT)在室温下的高频性能。在0.36V漏极偏压下同时获得290/335 GHz的优异组合截止频率fT/fmax,再次证明了AlSb/InAs HEMT能够以低功耗进行高频工作。提取了小信号等效电路参数。
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引用次数: 2
Advances in III–V semiconductor photonics: Nanostructures and integrated chips 半导体光子学进展:纳米结构和集成芯片
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562561
O. Wada
This paper reviews the progress of III-V semiconductor technology for the application to photonic telecommunications and signal processing systems by focusing nanostructure materials and devices as well as monolithic/hybrid integration technologies for improving performance and functions. Also the role of combined use of nanostructure devices and integration technology is discussed for the development of future energy efficient photonic systems.
本文综述了III-V半导体技术在光子通信和信号处理系统中的应用进展,重点介绍了纳米结构材料和器件以及单片/混合集成技术,以提高性能和功能。并讨论了纳米结构器件与集成技术的结合应用对未来高效光子系统发展的作用。
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引用次数: 2
Suppression of multi-photon emission in 1.5-µm quantum-dot single-photon source 1.5µm量子点单光子源中多光子发射的抑制
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562564
T. Miyazawa, K. Takemoto, Y. Sakuma, Hai-Xi Song, M. Takatsu, Tsuyoshi Yamamoto, Y. Arakawa
Photon-correlation function g(2)(τ) of a single `doublecapped' InAs/InP quantum dot (QD) was obtained with high accuracy using a superconducting single-photon detector (SSPD). By using resonant excitation to the e1h0 state in the single InAs/InP QD, g(2)(0) was decreased to the detection limit. Rabi oscillation of the PL intensity of e0h0 state is also observed under the resonant excitation into the e1h0 state. These results suggest that the coherent exciton generation into e1h0 state is effective to improve the purity of the single-photon emission.
利用超导单光子探测器(SSPD)高精度地获得了单个“双封盖”InAs/InP量子点(QD)的光子相关函数g(2)(τ)。通过对单个InAs/InP量子点的e1h0态进行共振激发,使g(2)(0)降低到检测极限。在进入e1h0态的共振激励下,还观察到e0h0态的PL强度的拉比振荡。这些结果表明,产生e1h0态的相干激子对提高单光子发射的纯度是有效的。
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引用次数: 0
MOCVD growth and device characterization of InP/GaAsSb/InP DHBTs with a GaAs spacer 带有GaAs间隔层的InP/GaAsSb/InP dhbt的MOCVD生长和器件表征
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562610
T. Hoshi, H. Sugiyama, H. Yokoyama, N. Kashio, K. Kurishima, M. Ida, H. Matsuzaki
This paper describes the impact of a GaAs spacer inserted between the InP emitter and GaAsSb base of InP/GaAsSb/InP double-heterojunction bipolar transistors (DHBTs) grown by metalorganic chemical vapor deposition. The GaAs spacer suppresses the incorporation of excess Sb atoms from the GaAsSb base into the InP emitter, which reduces the recombination current at the junction. The fabricated DHBTs with a 0.5-μm-wide emitter show dc current gain of over 90 at current density (JC) of 10 mA/μm2. The 0.25-μm-emitter DHBTs yield current-gain cut-off frequency (ft) of 384 GHz and maximum oscillation frequency (fmax) of 264 GHz at JC of 14 mA/μm2.
本文研究了金属有机化学气相沉积法生长的InP/GaAsSb/InP双极异质结晶体管(DHBTs)中,在InP发射极和GaAsSb基极之间插入GaAs衬垫对其性能的影响。GaAs间隔层抑制了过量的Sb原子从GaAsSb基底进入InP发射极,从而降低了结处的复合电流。在电流密度(JC)为10 mA/μm2时,所制备的发射极宽度为0.5 μm的DHBTs的直流增益大于90。在JC为14 mA/μm2时,0.25 μm-发射极dhbt的电流增益截止频率为384 GHz,最大振荡频率为264 GHz。
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引用次数: 0
High performacne InAs/AlSb HEMT with refractory iridium Schottky gate metal 含难熔铱肖特基栅金属的高性能InAs/AlSb HEMT
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562601
Wen-Yu Lin, Chao-Hung Chen, H. Chiu, F. Huang, W. Hsueh, Y. Hsin, J. Chyi
In the work, a novel approach in fabricating high-performance of InAs/AlSb high electron mobility transistors using iridium (Ir) gate technology was proposed and investigated. The Ir-gate exhibited a superior metal work function which was beneficial for increasing Schottky barrier height (ØB) of InAs/AlSb heterostructure from 0.54 to 0.58 eV. The Ir-gate InAs/AlSb HEMT exhibited a Vth of -0.9 V, a maximum drain current of 270 mA/mm, and a peak transconductance of 420 mS/mm. In contrast, the Vth of Ti-gate InAs/AlSb HEMT was - 1.5 V, a maximum drain current of 257mA/mm, and a peak transconductance of 280mS /mm, respectively. It was suggested that Ir interface presented a high potential for high power transistor applications.
本文提出并研究了一种利用铱栅极技术制备高性能InAs/AlSb高电子迁移率晶体管的新方法。ir栅极具有优异的金属功功能,有利于将InAs/AlSb异质结构的Schottky势垒高度(ØB)从0.54 eV提高到0.58 eV。ir栅InAs/AlSb HEMT的电压为-0.9 V,最大漏极电流为270 mA/mm,峰值跨导为420 mS/mm。相比之下,ti栅极InAs/AlSb HEMT的Vth为- 1.5 V,最大漏极电流为257mA/mm,峰值跨导为280mS /mm。认为红外接口在大功率晶体管中具有很大的应用潜力。
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引用次数: 0
Butt-joint built-in (BJB) structure for membrane photonic integration 薄膜光子集成的对接内置(BJB)结构
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562623
D. Inoue, Jieun Lee, T. Shindo, M. Futami, K. Doi, T. Amemiya, N. Nishiyama, S. Arai
On-chip optical interconnections have potential for replace global copper wires on LSI chips. I n this work, as an integration method, an OMVPE butt-joint regrowth of 175-nm thick GaInAsP/InP was conducted toward an integration of active and passive components. In the numerical calculation, a coupling efficiency and residual reflection of designed butt-joint coupling were estimated to be 98% and -40 dB, respectively. In the experimental method, we investigated the dependence of butt-joint interface morphology and regrown surface flatness on the side etch depth and the mesa angle. As a result, a flat regrown surface without degradation in crystalline quality was obtained.
片上光互连有可能取代LSI芯片上的全球铜线。在本工作中,作为一种集成方法,对175 nm厚GaInAsP/InP进行了OMVPE对接再生,实现了主动和被动组分的集成。在数值计算中,估计设计的对接联轴器的耦合效率和剩余反射分别为98%和-40 dB。在实验方法中,我们研究了对接界面形貌和再生表面平整度对侧蚀深度和台面角的依赖关系。结果,获得了一个平坦的再生表面,而结晶质量没有下降。
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引用次数: 6
35 nm mHEMT Technology for THz and ultra low noise applications 35nm mHEMT技术,适用于太赫兹和超低噪声应用
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562647
A. Leuther, A. Tessmann, M. Dammann, H. Massler, M. Schlechtweg, O. Ambacher
In this paper we present a very compact 0.28 × 0.55 mm2 six-stage terahertz monolithic integrated circuit (TMIC) using 35 nm gate length metamorphic high electron mobility transistors (mHEMTs). A linear gain of 20.3 dB at 610 GHz and more than 18 dB over the bandwidth from 557 to 616 GHz was achieved for a drain voltage Vd of only 0.6 V. The noise performance of the 35 nm mHEMT was investigated on the basis of a packaged H-band amplifier which achieved a small-signal gain of more than 20 dB between 220 and 300 GHz. The averaged measured noise figure was 6.1 dB which is to our knowledge the lowest published value of any MMIC technology in this frequency range. To determine the transistor reliability accelerated lifetime tests in air were done. Based on a 20 % gm_max degradation failure criterion a median time to failure of 1.8 × 105 h at a channel temperature of 75°C and VDS = 0.8 V was extrapolated
在本文中,我们提出了一个非常紧凑的0.28 × 0.55 mm2的六级太赫兹单片集成电路(TMIC),该电路使用35 nm栅长变形高电子迁移率晶体管(mHEMTs)。在漏极电压Vd仅为0.6 V的情况下,在610 GHz时实现了20.3 dB的线性增益,在557至616 GHz的带宽范围内实现了超过18 dB的线性增益。在封装的h波段放大器的基础上,研究了35 nm mHEMT的噪声性能,该放大器在220 ~ 300 GHz之间实现了超过20 dB的小信号增益。平均测量噪声系数为6.1 dB,据我们所知,这是该频率范围内任何MMIC技术的最低公布值。为了确定晶体管的可靠性,在空气中进行了加速寿命试验。基于20% gm_max的降解失效准则,外推了通道温度为75℃,VDS = 0.8 V时的中位失效时间为1.8 × 105 h
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引用次数: 57
Nature of the optical transition in (In,Ga)As(N)/GaP quantum dots (QDs): Effect of QD size, indium composition and nitrogen incorporation (in,Ga)As(N)/GaP量子点(QDs)的光学跃迁性质:QD尺寸、铟组成和氮掺入的影响
Pub Date : 2013-05-19 DOI: 10.1109/ICIPRM.2013.6562587
C. Robert, C. Cornet, K. Pereira da Silva, P. Turban, S. Mauger, T. Nguyen Thanh, J. Even, J. Jancu, M. Perrin, H. Folliot, T. Rohel, S. Tricot, A. Balocchi, P. Barate, X. Marie, P. Koenraad, M. Alonso, A. Goi, N. Bertru, O. Durand, A. Le Corre
The structural properties of (In,Ga)As/GaP quantum dots (QDs) are studied by plane view and cross scanning tunneling microscopy. Time-resolved and pressure dependent photoluminescence experiments show a ground optical transition of indirect type. Mixed k.p/tight-binding simulations indicate a possible indirect to direct crossover depending on indium content and QD size. The incorporation of nitrogen in QDs is finally shown.
采用平面观察和交叉扫描隧道显微镜研究了(In,Ga)As/GaP量子点的结构特性。时间分辨和压力相关的光致发光实验显示了间接型的地面光学跃迁。混合kp /紧密结合模拟表明,根据铟含量和量子点大小,可能存在间接或直接交叉。最后显示了氮在量子点中的掺入。
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引用次数: 0
期刊
2013 International Conference on Indium Phosphide and Related Materials (IPRM)
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