LTCC用收缩匹配共燃厚膜电阻器

S. Vesudevan, A. Shaikh
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引用次数: 2

摘要

低温共烧陶瓷(LTCC)技术的主要优点之一是能够将电阻、电容器和电感等无源元件集成到单片封装中。由于材料在加工过程中的相互作用,开发稳定的电阻器、电容器和电感材料是一个挑战。本文介绍了适用于Ferro A6磁带系统的兼容厚膜电阻器的研制。在烧制过程中,厚膜电阻器的收缩行为与胶带材料的收缩行为相匹配。这种收缩匹配导致了具有埋置电阻的无失真烧制LTCC封装。电阻器的配方是用10 /spl ω ///spl平方/到100 K/spl ω ///spl平方/的十档值来开发的。研究了该电阻器的片电阻、TCR值、ESD稳定性和电压处理等电性能。利用扫描电子显微镜(SEM)研究了电阻器在烧制过程中的微观结构发展。研究了不同埋置水平下电阻的片阻、TCR、ESD漂移和电压处理能力等电性能。研究了烧成时间、烧成温度和封装设计对不同层电阻电性能的影响
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Shrinkage matched cofireable thick film resistors for LTCC
One of the major advantages of low temperature cofired ceramic (LTCC) technology is the ability to integrate passive components such as resistors, capacitors and inductors into a monolithic package. Due to materials interaction during processing, it is challenging to develop cofirable resistor, capacitor and inductor materials. This paper describes the development of compatible thick film resistors for Ferro's A6 tape system. The shrinkage behavior of the thick film resistors was matched to that of the tape material during firing. This shrinkage matching resulted in a distortion-free fired LTCC package with buried resistors. The resistor formulations were developed with sheet resistance in decade values starting from 10 /spl Omega///spl square/ up to 100 K/spl Omega///spl square/. The electrical properties of the resistors such as sheet resistance, TCR values, ESD stability and voltage handling were studied and found to be good. The microstructure development of the resistor during firing was studied using the scanning electron microscope (SEM). The electrical properties of the buried resistors such as sheet resistance, TCR, drift on ESD, and voltage handling capacity were studied for different buried levels of the resistor from the surface. The effect of firing time and temperatures and package design on the electrical properties of the resistors at different layers was also studied.<>
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