大型(2.2 kV, 20a) MCT器件的关断失效机制

H. Lendenmann, W. Fichtner
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引用次数: 11

摘要

在本文中,我们提出了在感应负载下导致大尺寸MCT器件关断失效的现象机制。根据器件电流和箝位电压的不同,两种不同的机制会导致关断故障。在较低箝位电压或软开关条件下,SOA受到MOSFET和阴极设计规则的限制。在高电压和硬开关条件下,细丝的动态形成限制了SOA。失效现象与阴极布局细节、阳极结构、器件尺寸和负载电路无关,因此代表了MCT的基本限制。然而,对于这些参数的最佳选择,故障水平可以被推到高功率,允许设备的工业应用。采用不同尺寸和布局特征的MCT试样进行了试验研究,并对破坏装置进行了分析。使用设备模拟器SIMUL_/sub ISE/来识别故障机制。
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Turn-off failure mechanisms in large (2.2 kV, 20 A) MCT devices
In this paper we present the phenomenological mechanisms leading to turn-off failures for large size MCT devices under inductive loading. Depending on the device current and the clamping voltage two different mechanisms lead to turn-off failures. At lower clamping voltages or in soft switching conditions the SOA is limited by the MOSFET and cathode design rules. At higher voltages and in hard switched conditions the dynamic formation of filaments limits the SOA. The failure phenomena were found to be independent, of cathode layout details, anode structuring, device size, and load circuit, thus representing the fundamental limits of the MCT. However, for optimal selection of these parameters, the failure level can be pushed to high power permitting industrial application of the device. The experimental investigation was carried out with MCT samples of different sizes and layout features and by analysis of destructed devices. The device simulator SIMUL_/sub ISE/ was used to identify the failure mechanisms.
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