{"title":"避免在IC工业中使用表面分析的陷阱","authors":"Scott Edward Beck, A. G. Gilicinski","doi":"10.1109/ASMC.1995.484343","DOIUrl":null,"url":null,"abstract":"A variety of surface analytical tools are currently available. With each of these tools come hidden pitfalls that one map encounter in the process of doing surface analysis. Examples of the use of X-ray photoelectron spectroscopy (XPS), secondary ion mass spectrometry (SIMS), total reflection X-ray fluorescence (TXRF), and atomic force microscopy (AFM) in the development of a novel vapor phase cleaning methodology are used to illustrate many of these pitfalls. Suggestions are made to assist users of these techniques in avoiding these pitfalls.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Avoiding the pitfalls in the use of surface analysis in the IC industry\",\"authors\":\"Scott Edward Beck, A. G. Gilicinski\",\"doi\":\"10.1109/ASMC.1995.484343\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A variety of surface analytical tools are currently available. With each of these tools come hidden pitfalls that one map encounter in the process of doing surface analysis. Examples of the use of X-ray photoelectron spectroscopy (XPS), secondary ion mass spectrometry (SIMS), total reflection X-ray fluorescence (TXRF), and atomic force microscopy (AFM) in the development of a novel vapor phase cleaning methodology are used to illustrate many of these pitfalls. Suggestions are made to assist users of these techniques in avoiding these pitfalls.\",\"PeriodicalId\":237741,\"journal\":{\"name\":\"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop\",\"volume\":\"32 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-11-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.1995.484343\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.1995.484343","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Avoiding the pitfalls in the use of surface analysis in the IC industry
A variety of surface analytical tools are currently available. With each of these tools come hidden pitfalls that one map encounter in the process of doing surface analysis. Examples of the use of X-ray photoelectron spectroscopy (XPS), secondary ion mass spectrometry (SIMS), total reflection X-ray fluorescence (TXRF), and atomic force microscopy (AFM) in the development of a novel vapor phase cleaning methodology are used to illustrate many of these pitfalls. Suggestions are made to assist users of these techniques in avoiding these pitfalls.
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