{"title":"最近和未来的IGBT发展","authors":"G. Majumdar, T. Minato","doi":"10.1109/PCCON.2007.372992","DOIUrl":null,"url":null,"abstract":"IGBT module has many variations in order to find out an optimum saddle point on a triangle trade-off relationship among low loss, fast switching and robustness. One of the best solution, especially for automotive application, which requires the perfect safety, is the IPM with a protection circuit built-in inside of power module. In IPM, low loss characteristics could be achieved by the advanced IGBT structure like a CSTBT. Not only individual technology advance for both Silicon chip and package, but also chip-package interconnections are extremely important to achieve the best performance as a power module.","PeriodicalId":325362,"journal":{"name":"2007 Power Conversion Conference - Nagoya","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-04-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"23","resultStr":"{\"title\":\"Recent and Future IGBT Evolution\",\"authors\":\"G. Majumdar, T. Minato\",\"doi\":\"10.1109/PCCON.2007.372992\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"IGBT module has many variations in order to find out an optimum saddle point on a triangle trade-off relationship among low loss, fast switching and robustness. One of the best solution, especially for automotive application, which requires the perfect safety, is the IPM with a protection circuit built-in inside of power module. In IPM, low loss characteristics could be achieved by the advanced IGBT structure like a CSTBT. Not only individual technology advance for both Silicon chip and package, but also chip-package interconnections are extremely important to achieve the best performance as a power module.\",\"PeriodicalId\":325362,\"journal\":{\"name\":\"2007 Power Conversion Conference - Nagoya\",\"volume\":\"14 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-04-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"23\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 Power Conversion Conference - Nagoya\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/PCCON.2007.372992\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 Power Conversion Conference - Nagoya","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PCCON.2007.372992","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
IGBT module has many variations in order to find out an optimum saddle point on a triangle trade-off relationship among low loss, fast switching and robustness. One of the best solution, especially for automotive application, which requires the perfect safety, is the IPM with a protection circuit built-in inside of power module. In IPM, low loss characteristics could be achieved by the advanced IGBT structure like a CSTBT. Not only individual technology advance for both Silicon chip and package, but also chip-package interconnections are extremely important to achieve the best performance as a power module.