面向火炮发射过程的电子系统防护结构

Tianfang Peng, Zheng You
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引用次数: 0

摘要

火炮发射是电子系统面临的极其恶劣的环境之一。常用的灌封保护会将发射过程中的高频振动传递给电子元件,干扰其内部结构(如MEMS),增加弹药失效的概率。提出了一种面向火炮发射过程的电子系统防护结构。该结构可以承受高加速度,同时过滤高频振动,从而保护弹药中的电子元件。首先,建立了火炮发射过程的隔震模型,确定了结构的理想刚度和阻尼比;其次,采用减震、低刚度弹簧和可调液体阻尼器进行结构设计。实验结果表明,该结构在约35000g的冲击下保持完整,并能过滤500Hz以上的机械振动。此外,该装置的阻尼比可在0.04-0.26之间调节。最后,在该结构的保护下,对几种商用芯片进行了冲击实验。在没有盆栽保护的情况下,所有的芯片都经受住了大约18000克的冲击。
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A Protective Structure for Electronic Systems Facing Artillery Launching Process
Artillery launching is one of the extremely harsh environments faced by electronic systems. The commonly used potting protection will transmit the high-frequency vibration of the launching process to the electronic components, interfere with their internal structures (such as MEMS), and increase the probability of failure of the ammunition. This paper proposes a protective structure for electronic system facing artillery launching process. The structure can withstand the high-g acceleration, while filtering the high-frequency vibrations, so as to protect the electronic components in the ammunition. Firstly, we established a shock/vibration isolation model for the artillery launching process, and determined the ideal stiffness and damping ratio of the structure. Secondly, we designed the structure with a shock-resistant, low-rigidity spring and an adjustable liquid damper. The experimental result showed that the structure remained intact under the shock of about 35000g, and could filter the mechanical vibration above 500Hz. In addition, the damping ratio of the device could be adjusted between 0.04-0.26. Finally, we carried out shock experiments on several types of commercial chips with the protection of the structure. All of the chips had survived the shock of about 18000g without potting protection.
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