一种电感耦合链路的晶圆测试方法

2009 IEEE Asian Solid-State Circuits Conference Pub Date : 2009-12-22 DOI:10.1109/ASSCC.2009.5357251

Kazutaka Kasuga, Mitsuko Saito, Tsutomu Takeya, N. Miura, H. Ishikuro, T. Kuroda

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引用次数: 7

摘要

本文介绍了一种电感耦合链路的晶圆测试方法。在堆叠芯片之前，可以测试电感耦合链路是否正常工作。从电感耦合系数与发射机功耗的关系出发，提出了验证电感耦合链路运行的方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A Wafer test method of inductive-coupling link

This paper provides the method for Wafer test of an inductive-coupling link. The inductive-coupling link can be tested whether it operates correctly before stacking chips. We provided the method that verify the operation of an inductive-coupling link from the relation between coupling coefficient of inductors and power that transmitter consumes.

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2009 IEEE Asian Solid-State Circuits Conference

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