在低于50mn的情况下,嵌入式效应极的短通道抗扰度和电流驱动能力

E. Dubois, P. Bricout
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引用次数: 1

摘要

硅技术现在正在进入通道长度小于0.1 pm的范围。在这种深亚微米范围内,出于功耗、器件可靠性和速度性能的考虑,必须降低工作电压[11]。已经提出了几种尺度分析来探索mosfet的极限。根据工艺复杂程度,在外延和双栅结构中,[2]和[3]的结垢外限分别为50和30 nm。对短通道效应的控制(如阈值电压滚降和亚阈值摆幅增加)严重限制了传统平面结构(如[2])中通道长度小于50nm的缩放。另一方面,[3]中提出的双栅极结构具有合理的亚阈值特性,但仍然是一个技术挑战,并且需要栅极功函数的可控性来进行阈值调节。在双栅极结构和传统平面结构之间,提出了一种凹陷沟道结构。利用漂移扩散和蒙特卡罗模拟广泛研究了短通道效应的抗扰度和电流驱动能力。
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Short channel immunity and current drive capabilities of recessed mosfets in the sub-50 mn regime
IIntroduction Silicon technology is now entering in the sub 0.1 pm range of channel length. In this deep submicron regime, the operating voltage has to be reduced for power dissipation, device reliability and speed performance considerations [ 11. Several scaling analysis have been proposed to explore the ultimate limits of MOSFETs. According to the technological complexity, the outer limit of scaling was found to be 50 and 30 nm in [2] and [3], for epitaxial and dual gate structures, respectively. The control of short channel effects (e.g. threshold voltage roll-off and subthreshold swing increase) severely limits the scaling below 50nm of channel length in conventional planar structures as in [2]. On the other hand, the dual gate structure proposed in [3] exhibits reasonable subthreshold characteristics but still represents a technological challenge and requires gate work function controllability for threshold adjustment. A recessed channel structure is proposed as a technological compromise between dual gate and conventional planar structures. The immunity with respect to short channel effects and the current drive capabilities are extensively studied using drift-diffusion and Monte Carlo simulations.
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