多层电源/地平面瞬态仿真的混合建模方法

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2012-10-01 DOI:10.1109/EPEPS.2012.6457898

T. Watanabe

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引用次数: 1

摘要

电源完整性是三维集成电路和封装设计中的重要问题之一。通常，承载它们的电路板及其介面具有多层电源/地平面，在系统的配电网络(PDN)中起着重要作用。因此，多层电源/地平面的建模与仿真变得越来越重要。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Hybrid modeling method for transient simulation of multilayered power/ground planes

The power integrity is one of the serious problem in the design of three-dimensional integrated circuits and packaging. Usually, the board and interposer carrying them have multilayered power/ground plane, which plays an important role in the power distribution network (PDN) of the system. Therefore, the modeling and simulation of multilayered power/ground planes become increasingly important.

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2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems

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