基于离群值检测的PCB检测方法

Xin He, Y. Malaiya, A. Jayasumana, K. Parker, S. Hird
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引用次数: 8

摘要

电容式引线框测试是检测印刷电路板故障的有效方法。然而,电容测量受到测试过程中的机械变化和组件电气参数公差的影响,使得难以使用基于阈值的技术进行缺陷检测。提出了一种新的方法来识别可能是异常值的董事会。基于主成分分析(PCA),该方法以整体的方式处理单个连接器或插座的电容测量集,以克服测试数据中固有的测量和组件参数变化。通过在三个不同的电路板上进行测量,评估了该方法的有效性。提出并评价了提高方法分辨率的改进技术。
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An outlier detection based approach for PCB testing
Capacitive Leadframe testing is an effective approach for detecting faults in printed circuit boards. Capacitance measurements, however, are affected by mechanical variations during testing and by tolerances of electrical parameters of components, making it difficult to use threshold based techniques for defect detection. A novel approach is presented for identifying boards that are likely to be outliers. Based on Principal Components Analysis (PCA), this approach treats the set of capacitance measurements of individual connectors or sockets in a holistic manner to overcome the measurement and component parameter variations inherent in test data. The effectiveness of the method is evaluated using measurements on three different boards. Enhancements to the technique to increase the resolution of the method are presented and evaluated.
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