{"title":"BiFeO3薄膜中写一次读多次电阻开关的顶电极依赖性","authors":"Yajun Fu, Wei Tang, Jin Wang, Linhong Cao","doi":"10.1116/6.0002946","DOIUrl":null,"url":null,"abstract":"The electrode is one of the key factors that influences and controls the resistive switching characteristic of a resistive switching device. In this work, we investigated the write-once-read-many-times (WORM)-resistive switching behavior of BiFeO3 (BFO)-based devices with different top electrodes, including Pt, Ag, Cu, and Al. The WORM-resistive switching behavior has been observed in Pt/BFO/LaNiO3 (LNO), Ag/BFO/LNO, and Cu/BFO/LNO devices. In the initial high resistance state, the Pt/BFO/LNO device shows space-charge-limited current conduction due to the large Schottky barrier height at the Pt/BFO interface, while the Ag/BFO/LNO and Cu/BFO/LNO devices exhibit Schottky emission conduction due to the small barrier height at both top electrode/BFO and BFO/LNO interfaces. In the low resistance state, the metallic conduction of the Pt/BFO/LNO device is a result of the formation of conduction filaments composed of oxygen vacancies, and yet the metallic conduction of Ag/BFO/LNO and Cu/BFO/LNO devices is due to the formation of oxygen vacancies-incorporated metal conduction filaments (Ag and Cu, respectively). The observed hysteresis I-V curve of the Al/BFO/LNO device may be attributed to oxygen vacancies and defects caused by the formation of Al–O bond near the Al/BFO interface. Our results indicate that controlling an electrode is a prominent and feasible way to modulate the performance of resistive switching devices.","PeriodicalId":17571,"journal":{"name":"Journal of Vacuum Science and Technology","volume":"111 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Top electrode dependence of the write-once-read-many-times resistance switching in BiFeO3 films\",\"authors\":\"Yajun Fu, Wei Tang, Jin Wang, Linhong Cao\",\"doi\":\"10.1116/6.0002946\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The electrode is one of the key factors that influences and controls the resistive switching characteristic of a resistive switching device. In this work, we investigated the write-once-read-many-times (WORM)-resistive switching behavior of BiFeO3 (BFO)-based devices with different top electrodes, including Pt, Ag, Cu, and Al. The WORM-resistive switching behavior has been observed in Pt/BFO/LaNiO3 (LNO), Ag/BFO/LNO, and Cu/BFO/LNO devices. In the initial high resistance state, the Pt/BFO/LNO device shows space-charge-limited current conduction due to the large Schottky barrier height at the Pt/BFO interface, while the Ag/BFO/LNO and Cu/BFO/LNO devices exhibit Schottky emission conduction due to the small barrier height at both top electrode/BFO and BFO/LNO interfaces. In the low resistance state, the metallic conduction of the Pt/BFO/LNO device is a result of the formation of conduction filaments composed of oxygen vacancies, and yet the metallic conduction of Ag/BFO/LNO and Cu/BFO/LNO devices is due to the formation of oxygen vacancies-incorporated metal conduction filaments (Ag and Cu, respectively). The observed hysteresis I-V curve of the Al/BFO/LNO device may be attributed to oxygen vacancies and defects caused by the formation of Al–O bond near the Al/BFO interface. Our results indicate that controlling an electrode is a prominent and feasible way to modulate the performance of resistive switching devices.\",\"PeriodicalId\":17571,\"journal\":{\"name\":\"Journal of Vacuum Science and Technology\",\"volume\":\"111 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Vacuum Science and Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1116/6.0002946\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Vacuum Science and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1116/6.0002946","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Top electrode dependence of the write-once-read-many-times resistance switching in BiFeO3 films
The electrode is one of the key factors that influences and controls the resistive switching characteristic of a resistive switching device. In this work, we investigated the write-once-read-many-times (WORM)-resistive switching behavior of BiFeO3 (BFO)-based devices with different top electrodes, including Pt, Ag, Cu, and Al. The WORM-resistive switching behavior has been observed in Pt/BFO/LaNiO3 (LNO), Ag/BFO/LNO, and Cu/BFO/LNO devices. In the initial high resistance state, the Pt/BFO/LNO device shows space-charge-limited current conduction due to the large Schottky barrier height at the Pt/BFO interface, while the Ag/BFO/LNO and Cu/BFO/LNO devices exhibit Schottky emission conduction due to the small barrier height at both top electrode/BFO and BFO/LNO interfaces. In the low resistance state, the metallic conduction of the Pt/BFO/LNO device is a result of the formation of conduction filaments composed of oxygen vacancies, and yet the metallic conduction of Ag/BFO/LNO and Cu/BFO/LNO devices is due to the formation of oxygen vacancies-incorporated metal conduction filaments (Ag and Cu, respectively). The observed hysteresis I-V curve of the Al/BFO/LNO device may be attributed to oxygen vacancies and defects caused by the formation of Al–O bond near the Al/BFO interface. Our results indicate that controlling an electrode is a prominent and feasible way to modulate the performance of resistive switching devices.