基于宽带隙半导体的集成电路

Chip Pub Date : 2023-12-01 DOI:10.1016/j.chip.2023.100072
Saravanan Yuvaraja, Vishal Khandelwal, Xiao Tang, Xiaohang Li
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引用次数: 0

摘要

宽带隙半导体的能带隙远大于硅等传统半导体,因此在电子和光电领域的应用前景非常广阔。半导体的突出例子包括碳化硅、氮化镓、氧化锌和金刚石,它们具有独特的特性,如较高的迁移率和热导率。这些特性有助于各种器件的运行,包括高能效双极结晶体管(BJT)、金属氧化物半导体场效应晶体管(MOSFET)、高频高电子迁移率晶体管(HEMT)以及发光二极管(LED)和激光器等光电元件。这些半导体用于构建集成电路 (IC),以促进电力电子设备、计算机设备、射频系统和其他光电技术进步的运行。这些突破包括成像、光通信和传感等各种应用。其中,近年来随着宽带隙(WBG)半导体器件的发展,电力电子器件领域取得了巨大进步,这种器件能够以较低的损耗快速切换大电流和电压。然而,将这些器件与复杂控制功能所需的硅互补金属氧化物半导体(CMOS)逻辑电路集成在一起已被证明是一项挑战。硅 CMOS 与 WBG 器件的单片集成增加了制造单片集成智能集成电路 (IC) 的复杂性。这篇综述文章提出了直接在 WBG 平台上实现 CMOS 逻辑的解决方案。然而,采用 WBG 材料实现 CMOS 功能仍然是一个重大障碍。本文总结了采用从碳化硅到金刚石等各种 WBG 材料制造集成电路的研究进展,目标是构建未来的智能功率集成电路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Wide bandgap semiconductor-based integrated circuits

Wide-bandgap semiconductors exhibit much larger energy bandgaps than traditional semiconductors such as silicon, rendering them very promising to be applied in the fields of electronics and optoelectronics. Prominent examples of semiconductors include SiC, GaN, ZnO, and diamond, which exhibit distinctive characteristics such as elevated mobility and thermal conductivity. These characteristics facilitate the operation of a wide range of devices, including energy-efficient bipolar junction transistors (BJTs) and metal-oxide-semiconductor field-effect transistors (MOSFETs), as well as high-frequency high-electron-mobility transistors (HEMTs) and optoelectronic components such as light-emitting diodes (LEDs) and lasers. These semiconductors are used in building integrated circuits (ICs) to facilitate the operation of power electronics, computer devices, RF systems, and other optoelectronic advancements. These breakthroughs include various applications such as imaging, optical communication, and sensing. Among them, the field of power electronics has witnessed tremendous progress in recent years with the development of wide bandgap (WBG) semiconductor devices, which is capable of switching large currents and voltages rapidly with low losses. However, it has been proven challenging to integrate these devices with silicon complementary metal oxide semiconductor (CMOS) logic circuits required for complex control functions. The monolithic integration of silicon CMOS with WBG devices increases the complexity of fabricating monolithically integrated smart integrated circuits (ICs). This review article proposes implementing CMOS logic directly on the WBG platform as a solution. However, achieving the CMOS functionalities with the adoption of WBG materials still remains a significant hurdle. This article summarizes the research progress in the fabrication of integrated circuits adopting various WBG materials ranging from SiC to diamond, with the goal of building future smart power ICs.

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