Xuliang Yao, Xiao Han, Yuefeng Liao, Jingfang Wang
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Light-load performance optimization for LLC resonant converter
Purpose This study aims to solve the problem that under light-load conditions, the output voltage regulation capability is lost due to the fact that the voltage gain of the LLC resonant converter does not decrease with the increase of the switching frequency. Design/methodology/approach In this paper, the impedance model considering the parasitic parameters of the primary and secondary sides is calculated under light-load conditions, the limitations of the previous method are explained and a new circuit improvement is proposed. Findings In this paper, an improved circuit is proposed, and the impedance Bode plot is used to verify that the circuit can effectively improve the voltage gain problem under light-load conditions. Finally, the experimental results verify the effectiveness of the proposed circuit through comparison with traditional solutions and circuits. Originality/value In this paper, the impedance model considering the parasitic parameters of the primary and secondary sides is calculated, the limitations of the previous method are explained and a new circuit improvement is proposed. When compared with the previous method, the proposed circuit improvement can suppress the voltage gain increase that occurs when the switching frequency increases to a certain level.
期刊介绍:
Circuit World is a platform for state of the art, technical papers and editorials in the areas of electronics circuit, component, assembly, and product design, manufacture, test, and use, including quality, reliability and safety. The journal comprises the multidisciplinary study of the various theories, methodologies, technologies, processes and applications relating to todays and future electronics. Circuit World provides a comprehensive and authoritative information source for research, application and current awareness purposes.
Circuit World covers a broad range of topics, including:
• Circuit theory, design methodology, analysis and simulation
• Digital, analog, microwave and optoelectronic integrated circuits
• Semiconductors, passives, connectors and sensors
• Electronic packaging of components, assemblies and products
• PCB design technologies and processes (controlled impedance, high-speed PCBs, laminates and lamination, laser processes and drilling, moulded interconnect devices, multilayer boards, optical PCBs, single- and double-sided boards, soldering and solderable finishes)
• Design for X (including manufacturability, quality, reliability, maintainability, sustainment, safety, reuse, disposal)
• Internet of Things (IoT).