深度神经网络内存处理体系结构的深入研究

IF 0.5 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Semiconductor Technology and Science Pub Date : 2023-10-31 DOI:10.5573/jsts.2023.23.5.322
Ji-Hoon Jang, Jin Shin, Jun-Tae Park, In-Seong Hwang, Hyun Kim
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引用次数: 0

摘要

内存中处理(PIM)是一种新兴的计算体系结构,近年来得到了极大的关注。它旨在通过摆脱传统的冯·诺伊曼架构来最大化数据移动效率。PIM特别适合处理需要在处理单元和存储设备之间进行大量数据移动的深度神经网络(dnn)。因此,在这一领域进行了大量的研究。为了在PIM架构中最优地处理具有不同结构和归纳偏差的dnn,例如卷积神经网络、图卷积网络、循环神经网络和变压器,应该仔细考虑PIM中如何处理数据映射和数据流。本文旨在通过分析各种深度神经网络的特征,并详细解释如何使用商用内存技术(如DRAM)和下一代内存技术(如ReRAM)在PIM架构中实现它们,从而深入了解这些方面。
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In-depth Survey of Processing-in-memory Architectures for Deep Neural Networks
Processing-in-Memory (PIM) is an emerging computing architecture that has gained significant attention in recent times. It aims to maximize data movement efficiency by moving away from the traditional von Neumann architecture. PIM is particularly well-suited for handling deep neural networks (DNNs) that require significant data movement between the processing unit and the memory device. As a result, there has been substantial research in this area. To optimally handle DNNs with diverse structures and inductive biases, such as convolutional neural networks, graph convolutional networks, recurrent neural networks, and transformers, within a PIM architecture, careful consideration should be given to how data mapping and data flow are processed in PIM. This paper aims to provide insight into these aspects by analyzing the characteristics of various DNNs and providing detailed explanations of how they have been implemented with PIM architectures using commercially available memory technologies like DRAM and next-generation memory technologies like ReRAM.
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来源期刊
Journal of Semiconductor Technology and Science
Journal of Semiconductor Technology and Science ENGINEERING, ELECTRICAL & ELECTRONIC-PHYSICS, APPLIED
CiteScore
0.90
自引率
0.00%
发文量
40
审稿时长
6-12 weeks
期刊介绍: Journal of Semiconductor Technology and Science is published to provide a forum for R&D people involved in every aspect of the integrated circuit technology, i.e., VLSI fabrication process technology, VLSI device technology, VLSI circuit design and other novel applications of this mass production technology. When IC was invented, these people worked together in one place. However, as the field of IC expanded, our individual knowledge became narrower, creating different branches in the technical society, which has made it more difficult to communicate as a whole. The fisherman, however, always knows that he can capture more fish at the border where warm and cold-water meet. Thus, we decided to go backwards gathering people involved in all VLSI technology in one place.
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