评论家的认可

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Packaging Pub Date : 2023-02-01 DOI:10.1115/1.4056725
{"title":"评论家的认可","authors":"","doi":"10.1115/1.4056725","DOIUrl":null,"url":null,"abstract":"The Reviewers of the Year Award is given to reviewers who have made an outstanding contribution to the journal in terms of the quantity, quality, and turnaround time of reviews completed during the past 12 months. The prize includes a Wall Plaque, 50 free downloads from the ASME Digital Collection, and a one year free subscription to the journal.T. AnH. BaiM. BudakliF. CheJ. ChenT. ChenH. ChengT. ChiuM. ChowdhuryO. DalvernyB. DogruozC. GanR. GhaffarianD. Gonzalez CuadradoC. GreenP. GromalaM. GuptaY. HuangD. HuitinkT. IkedaC. KapustaB. KellyC. KhorH. LeeD. LiuA. MianK. MysoreD. NarasimhanJ. NiG. OnushkinD. PahinkarD. PantusoS. ParupalliG. PavlidisD. Ramos AlvaradoD. RaoM. ShihA. SinghJ. TsaiA. UdupaA. UsmanM. Van DijkW. Van DrielM. Van SoestbergenG. WangR. WarzohaJ. XuJ. YangM. Yazdan MehrA. YeoD. YuC. YuanZ. ZhangS. ZhaoQ. Zheng","PeriodicalId":15663,"journal":{"name":"Journal of Electronic Packaging","volume":null,"pages":null},"PeriodicalIF":2.2000,"publicationDate":"2023-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Reviewer's Recognition\",\"authors\":\"\",\"doi\":\"10.1115/1.4056725\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The Reviewers of the Year Award is given to reviewers who have made an outstanding contribution to the journal in terms of the quantity, quality, and turnaround time of reviews completed during the past 12 months. The prize includes a Wall Plaque, 50 free downloads from the ASME Digital Collection, and a one year free subscription to the journal.T. AnH. BaiM. BudakliF. CheJ. ChenT. ChenH. ChengT. ChiuM. ChowdhuryO. DalvernyB. DogruozC. GanR. GhaffarianD. Gonzalez CuadradoC. GreenP. GromalaM. GuptaY. HuangD. HuitinkT. IkedaC. KapustaB. KellyC. KhorH. LeeD. LiuA. MianK. MysoreD. NarasimhanJ. NiG. OnushkinD. PahinkarD. PantusoS. ParupalliG. PavlidisD. Ramos AlvaradoD. RaoM. ShihA. SinghJ. TsaiA. UdupaA. UsmanM. Van DijkW. Van DrielM. Van SoestbergenG. WangR. WarzohaJ. XuJ. YangM. Yazdan MehrA. YeoD. YuC. YuanZ. ZhangS. ZhaoQ. Zheng\",\"PeriodicalId\":15663,\"journal\":{\"name\":\"Journal of Electronic Packaging\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.2000,\"publicationDate\":\"2023-02-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1115/1.4056725\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/1.4056725","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

年度审稿人奖颁发给在过去12个月内完成的审稿数量、质量和周转时间方面对期刊做出杰出贡献的审稿人。奖品包括一块墙上的牌匾,50个免费下载的ASME数字合集,以及一年的免费订阅。无水的。拜姆。BudakliF。CheJ。ChenT。ChenH。ChengT。ChiuM。ChowdhuryO。DalvernyB。DogruozC。GanR。GhaffarianD。冈萨雷斯CuadradoC。GreenP。GromalaM。GuptaY。HuangD。HuitinkT。IkedaC。KapustaB。KellyC。KhorH。LeeD。LiuA。MianK。迈索尔。NarasimhanJ。国家行业集团公司。OnushkinD。PahinkarD。PantusoS。ParupalliG。PavlidisD。拉莫斯AlvaradoD。RaoM。ShihA。SinghJ。TsaiA。UdupaA。UsmanM。范DijkW。范DrielM。范SoestbergenG。WangR。WarzohaJ。XuJ。YangM。Yazdan用。YeoD。YuC。YuanZ。丈。ZhaoQ。郑
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Reviewer's Recognition
The Reviewers of the Year Award is given to reviewers who have made an outstanding contribution to the journal in terms of the quantity, quality, and turnaround time of reviews completed during the past 12 months. The prize includes a Wall Plaque, 50 free downloads from the ASME Digital Collection, and a one year free subscription to the journal.T. AnH. BaiM. BudakliF. CheJ. ChenT. ChenH. ChengT. ChiuM. ChowdhuryO. DalvernyB. DogruozC. GanR. GhaffarianD. Gonzalez CuadradoC. GreenP. GromalaM. GuptaY. HuangD. HuitinkT. IkedaC. KapustaB. KellyC. KhorH. LeeD. LiuA. MianK. MysoreD. NarasimhanJ. NiG. OnushkinD. PahinkarD. PantusoS. ParupalliG. PavlidisD. Ramos AlvaradoD. RaoM. ShihA. SinghJ. TsaiA. UdupaA. UsmanM. Van DijkW. Van DrielM. Van SoestbergenG. WangR. WarzohaJ. XuJ. YangM. Yazdan MehrA. YeoD. YuC. YuanZ. ZhangS. ZhaoQ. Zheng
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
期刊最新文献
Process Recipe and Functional Circuitry Performance On Aerosol Jet Printed Water-Based Silver Ink Incorporating Tensile Stress into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints Transient Liquid Phase Bond Acceleration Using Copper Nanowires Impact of Immersion Cooling On Thermomechanical Properties of Halogen-free Substrate Core Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1