{"title":"对高度翘曲模具进行减薄和抛光以使其厚度接近一致的工艺:第二部分","authors":"Kirk A. Martin","doi":"10.31399/asm.edfa.2023-1.p016","DOIUrl":null,"url":null,"abstract":"Abstract The processes and considerations for locally thinning an area of interest to the desired remaining silicon thickness are described.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Processes for Thinning and Polishing Highly Warped Die to a Nearly Consistent Thickness: Part II\",\"authors\":\"Kirk A. Martin\",\"doi\":\"10.31399/asm.edfa.2023-1.p016\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Abstract The processes and considerations for locally thinning an area of interest to the desired remaining silicon thickness are described.\",\"PeriodicalId\":431761,\"journal\":{\"name\":\"EDFA Technical Articles\",\"volume\":\"20 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-02-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"EDFA Technical Articles\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.31399/asm.edfa.2023-1.p016\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"EDFA Technical Articles","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.31399/asm.edfa.2023-1.p016","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
