离子注入和结晶氧化物的退火

C.W. White, C.J. McHargue, P.S. Sklad, L.A. Boatner, G.C. Farlow
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摘要

离子注入技术是改变绝缘材料近表面特性的一种通用方法。这些研究背后的主要动机是发展离子注入作为控制和改善绝缘体近表面机械,光学或电子特性的实用手段。这些性能的变化取决于离子注入过程和随后的热处理过程中材料的微观结构和成分的变化。在许多情况下,可以通过植入和热退火产生传统技术无法实现的结构和组合物。在这项工作中,广泛的晶体氧化物对离子注入和随后的热处理的响应将被回顾。这里处理的材料包括Al2O3、LiNbO3、CaTiO3、SrTiO3、ZnO和MgO,以及非氧化物材料Si3N4和SiC。这些绝缘体对离子注入的响应变化很大,取决于特定的材料、注入种类和剂量以及注入温度。离子注入在近表面区域产生位移和其他损伤,在许多情况下,原本结晶的绝缘子表面变成非晶。热退火通常可以用于恢复受损近表面区域的结晶度,另外,可以产生亚稳固溶体。对于许多氧化物材料,利用卢瑟福反向散射离子通道技术和透射电子显微镜对其退火行为进行了详细的研究。这些研究表明,在某些材料中,退火行为非常简单,通过固相外延结晶进行,在退火过程中,在向自由表面移动的界面处发生非晶向晶的转变。在这种材料中,已经测量了再生动力学,并确定了结晶的相关活化能。本文还讨论了非晶相结晶过程中亚稳固溶体的形成。
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Ion implantation and annealing of crystalline oxides

The technique of ion implantation is being investigated as a general method for altering the near-surface properties of insulating materials. The primary motivation behind these investigations is to develop ion implantation as a practical means of controlling and improving the near-surface mechanical, optical, or electronic properties of insulators. Changes in these properties depend on the microstructures and compositions developed in the material during the ion implantation process and subsequent thermal treatments. In many cases, structures and compositions can be produced by implantation and thermal annealing that cannot be achieved by conventional techniques. In this work, the response of a wide range of crystalline oxides to ion implantation and subsequent thermal processing will be reviewed. The materials treated here include Al2O3, LiNbO3, CaTiO3, SrTiO3, ZnO, and MgO, as well as the non-oxide materials Si3N4 and SiC. The response of these insulators to ion implantation varies widely and depends on the specific material, the implantation species and dose, and the implantation temperature. Ion implantation produces displacement and other damage in the near-surface region, and in many cases, the surfaces of originally crystalline insulators are turned amorphous. Thermal annealing can often be used to restore crystallinity to the damaged near-surface region, and additionally, metastable solid solutions can be produced. For a number of oxide materials, the annealing behavior has been studied in detail using both Rutherford backscattering-ion channeling techniques and transmission electron microscopy. These studies show that, in some materials, the annealing behavior is quite simple and takes place by solid-phase epitaxial crystallization where the amorphous-to-crystalline transformation occurs at an interface that moves toward the free surface during the annealing process. In such materials, the regrowth kinetics have been measured, and the associated activation energies for crystallization have been determined. The formation of metastable solid solutions during crystallization of the amorphous phase will also be discussed.

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