虚拟保护环宽度对 180 纳米标准 CMOS 技术 SPAD 检测器性能影响的研究

IF 4.8 4区 物理与天体物理 Q2 PHYSICS, CONDENSED MATTER Journal of Semiconductors Pub Date : 2023-11-01 DOI:10.1088/1674-4926/44/11/114102
Danlu Liu, Ming Li, Tang Xu, Jie Dong, Yuming Fang, Yue Xu
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引用次数: 0

摘要

研究了虚拟护环宽度(GRW)对 180 nm 标准 CMOS 工艺中 p 孔/深 n 孔单光子雪崩二极管(SPAD)性能的影响。TCAD 仿真表明,当 GRW 减小到 1 μm 时,护环中的电场强度和电流密度明显增强。实验发现,与 GRW = 2 μm 的 SPAD 相比,GRW = 1 μm 的 SPAD 的暗计数率(DCR)和后脉冲概率(AP)分别显著提高了 2.7 倍和 2 倍,同时其光子检测概率(PDP)达到饱和,在超过 2 V 的过偏压下难以提升。虽然降低 GRW 可以提高填充因子(FF),但由于 1 μm 护环区域的陷阱辅助隧道效应(TAT)增强,器件的暗噪受到了负面影响。相比之下,GRW = 2 μm 的 SPAD 能更好地权衡 FF 和噪声性能。我们的研究为实现大型阵列应用中的低噪声 SPAD 提供了护环设计指南。
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Study of the influence of virtual guard ring width on the performance of SPAD detectors in 180 nm standard CMOS technology
The influence of the virtual guard ring width (GRW) on the performance of the p-well/deep n-well single-photon avalanche diode (SPAD) in a 180 nm standard CMOS process was investigated. TCAD simulation demonstrates that the electric field strength and current density in the guard ring are obviously enhanced when GRW is decreased to 1 μm. It is experimentally found that, compared with an SPAD with GRW = 2 μm, the dark count rate (DCR) and afterpulsing probability (AP) of the SPAD with GRW = 1 μm is significantly increased by 2.7 times and twofold, respectively, meanwhile, its photon detection probability (PDP) is saturated and hard to be promoted at over 2 V excess bias voltage. Although the fill factor (FF) can be enlarged by reducing GRW, the dark noise of devices is negatively affected due to the enhanced trap-assisted tunneling (TAT) effect in the 1 μm guard ring region. By comparison, the SPAD with GRW = 2 μm can achieve a better trade-off between the FF and noise performance. Our study provides a design guideline for guard rings to realize a low-noise SPAD for large-array applications.
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来源期刊
Journal of Semiconductors
Journal of Semiconductors PHYSICS, CONDENSED MATTER-
CiteScore
6.70
自引率
9.80%
发文量
119
期刊介绍: Journal of Semiconductors publishes articles that emphasize semiconductor physics, materials, devices, circuits, and related technology.
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