晶圆级合成二维集成电子材料

Chip Pub Date : 2024-03-01 DOI:10.1016/j.chip.2023.100080
Zijia Liu , Xunguo Gong , Jinran Cheng , Lei Shao , Chunshui Wang , Jian Jiang , Ruiqing Cheng , Jun He
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引用次数: 0

摘要

二维(2D)范德华材料因其新颖的物理性质和与传统微加工技术的高度兼容性而备受后摩尔电子技术发展的关注。二维范德华材料的晶圆级合成已成为大规模集成应用的关键挑战。尽管一些二维材料的晶圆级合成方法已得到广泛探索,但如何制备厚度控制良好的高质量薄膜仍是一大挑战。本综述重点介绍二维材料的晶圆级合成及其在集成电子学中的应用。首先,我们介绍了几种具有代表性的二维层状材料,包括它们的晶体结构和独特的电子特性。然后,深入综述了目前在晶圆级合成二维层状材料的策略,分为 "自上而下 "和 "自下而上 "两种。然后,讨论了二维材料晶圆在集成电子和光电器件中的应用。最后,介绍了二维集成电子器件当前面临的挑战和未来的发展前景。我们希望这篇综述能为晶圆级二维材料及其集成应用的发展提供全面而深刻的指导。
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Wafer-scale synthesis of two-dimensional materials for integrated electronics

Two-dimensional (2D) van der Waals materials have attracted great interest and facilitated the development of post-Moore electronics owing to their novel physical properties and high compatibility with traditional microfabrication techniques. Their wafer-scale synthesis has become a critical challenge for large-scale integrated applications. Although the wafer-scale synthesis approaches for some 2D materials have been extensively explored, the preparation of high-quality thin films with well-controlled thickness remains a big challenge. This review focuses on the wafer-scale synthesis of 2D materials and their applications in integrated electronics. Firstly, several representative 2D layered materials including their crystal structures and unique electronic properties were introduced. Then, the current synthesis strategies of 2D layered materials at the wafer scale, which are divided into “top-down” and “bottom-up”, were reviewed in depth. Afterwards, the applications of 2D materials wafer in integrated electrical and optoelectronic devices were discussed. Finally, the current challenges and future prospects for 2D integrated electronics were presented. It is hoped that this review will provide comprehensive and insightful guidance for the development of wafer-scale 2D materials and their integrated applications.

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