未来是冰冻的:用于高性能计算的低温 CMOS(特邀)

Chip Pub Date : 2024-03-01 DOI:10.1016/j.chip.2023.100082
R. Saligram, A. Raychowdhury, Suman Datta
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引用次数: 0

摘要

低温 CMOS 或低温 CMOS 是延续摩尔定律并满足高性能计算 (HPC) 需求的一条大有可为的途径。利用温度作为控制 "旋钮",可使 CMOS 器件的阈下斜率行为变得陡峭,从而在不影响运行速度的情况下降低工作电源电压。通过优化阈值电压工程,可以进一步提高器件的导通电流,从而实现更高的性能。在本文中,我们使用实验校准数据来调整阈值电压,并在器件、电路和系统层面研究低温 CMOS 的功率性能区 (PPA)。我们还介绍了对在低温条件下工作的 28nm 块状 CMOS 和 22nm FDSOI 制造的功能存储器芯片的测量和分析结果。最后,我们还将讨论进一步开发和部署此类系统所面临的挑战和机遇。
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The future is frozen: cryogenic CMOS for high-performance computing

Low temperature complementary metal oxide semiconductor (CMOS) or cryogenic CMOS is a promising avenue for the continuation of Moore's law while serving the needs of high performance computing. With temperature as a control “knob” to steepen the subthreshold slope behavior of CMOS devices, the supply voltage of operation can be reduced with no impact on operating speed. With the optimal threshold voltage engineering, the device ON current can be further enhanced, translating to higher performance. In this article, the experimentally calibrated data was adopted to tune the threshold voltage and investigated the power performance area of cryogenic CMOS at device, circuit and system level. We also presented results from measurement and analysis of functional memory chips fabricated in 28 nm bulk CMOS and 22 nm fully depleted silicon on insulator (FDSOI) operating at cryogenic temperature. Finally, the challenges and opportunities in the further development and deployment of such systems were discussed.

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