通过热力学分析和动力学计算对六氯二硅烷气相反应的理论研究

IF 1.5 4区 物理与天体物理 Q3 PHYSICS, APPLIED Japanese Journal of Applied Physics Pub Date : 2024-01-04 DOI:10.35848/1347-4065/ad0fa0
Tomoya Nagahashi, Hajime Karasawa, Ryota Horiike, Kenji Shiraishi
{"title":"通过热力学分析和动力学计算对六氯二硅烷气相反应的理论研究","authors":"Tomoya Nagahashi, Hajime Karasawa, Ryota Horiike, Kenji Shiraishi","doi":"10.35848/1347-4065/ad0fa0","DOIUrl":null,"url":null,"abstract":"We conducted thermodynamic analysis and kinetics calculations for hexachlorodisilane (Si<sub>2</sub>Cl<sub>6</sub>), which is used as source gas for the CVD of silicon nitride films. Thermodynamic analysis clarified Si<sub>2</sub>Cl<sub>6</sub> decomposes almost completely to SiCl<sub>4</sub> and SiCl<sub>2</sub> in the range of 600 °C–1100 °C under equilibrium condition. Therefore, it is estimated that the main gas-phase reaction of Si<sub>2</sub>Cl<sub>6</sub> is represented by the reaction Si<sub>2</sub>Cl<sub>6</sub> → SiCl<sub>4</sub> + SiCl<sub>2</sub>. Thermodynamic analysis also shows that the Si<sub>2</sub>Cl<sub>6</sub> system has a larger equilibrium partial pressure of SiCl<sub>2</sub> than SiH<sub>x</sub>Cl<sub>4-x</sub> (x = 1 ~ 3) systems. Kinetics calculations revealed Si<sub>2</sub>Cl<sub>6</sub> decomposes by 90% in 0.11 s at 600 °C, and 0.55 × 10<sup>−3 </sup>s at 800 °C, respectively. The time-dependent pyrolysis ratio of Si<sub>2</sub>Cl<sub>6</sub> becomes larger as the total pressure decreases at 600 °C. On the other hand, the ratio is almost the same regardless of total pressure at 800 °C. These results will help optimize CVD process conditions using Si<sub>2</sub>Cl<sub>6</sub>.","PeriodicalId":14741,"journal":{"name":"Japanese Journal of Applied Physics","volume":"37 1","pages":""},"PeriodicalIF":1.5000,"publicationDate":"2024-01-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Theoretical study of the gas-phase reaction of hexachlorodisilane by thermodynamic analysis and kinetics calculation\",\"authors\":\"Tomoya Nagahashi, Hajime Karasawa, Ryota Horiike, Kenji Shiraishi\",\"doi\":\"10.35848/1347-4065/ad0fa0\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We conducted thermodynamic analysis and kinetics calculations for hexachlorodisilane (Si<sub>2</sub>Cl<sub>6</sub>), which is used as source gas for the CVD of silicon nitride films. Thermodynamic analysis clarified Si<sub>2</sub>Cl<sub>6</sub> decomposes almost completely to SiCl<sub>4</sub> and SiCl<sub>2</sub> in the range of 600 °C–1100 °C under equilibrium condition. Therefore, it is estimated that the main gas-phase reaction of Si<sub>2</sub>Cl<sub>6</sub> is represented by the reaction Si<sub>2</sub>Cl<sub>6</sub> → SiCl<sub>4</sub> + SiCl<sub>2</sub>. Thermodynamic analysis also shows that the Si<sub>2</sub>Cl<sub>6</sub> system has a larger equilibrium partial pressure of SiCl<sub>2</sub> than SiH<sub>x</sub>Cl<sub>4-x</sub> (x = 1 ~ 3) systems. Kinetics calculations revealed Si<sub>2</sub>Cl<sub>6</sub> decomposes by 90% in 0.11 s at 600 °C, and 0.55 × 10<sup>−3 </sup>s at 800 °C, respectively. The time-dependent pyrolysis ratio of Si<sub>2</sub>Cl<sub>6</sub> becomes larger as the total pressure decreases at 600 °C. On the other hand, the ratio is almost the same regardless of total pressure at 800 °C. These results will help optimize CVD process conditions using Si<sub>2</sub>Cl<sub>6</sub>.\",\"PeriodicalId\":14741,\"journal\":{\"name\":\"Japanese Journal of Applied Physics\",\"volume\":\"37 1\",\"pages\":\"\"},\"PeriodicalIF\":1.5000,\"publicationDate\":\"2024-01-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Japanese Journal of Applied Physics\",\"FirstCategoryId\":\"101\",\"ListUrlMain\":\"https://doi.org/10.35848/1347-4065/ad0fa0\",\"RegionNum\":4,\"RegionCategory\":\"物理与天体物理\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"PHYSICS, APPLIED\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Japanese Journal of Applied Physics","FirstCategoryId":"101","ListUrlMain":"https://doi.org/10.35848/1347-4065/ad0fa0","RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"PHYSICS, APPLIED","Score":null,"Total":0}
引用次数: 0

摘要

我们对用作氮化硅薄膜 CVD 源气体的六氯二硅烷(Si2Cl6)进行了热力学分析和动力学计算。热力学分析表明,在 600 ℃-1100 ℃ 的平衡条件下,Si2Cl6 几乎完全分解为 SiCl4 和 SiCl2。因此,估计 Si2Cl6 的主要气相反应为 Si2Cl6 → SiCl4 + SiCl2 反应。热力学分析还表明,与 SiHxCl4-x (x = 1 ~ 3)体系相比,Si2Cl6 体系的 SiCl2 平衡分压较大。动力学计算显示,Si2Cl6 在 600 ℃ 时 0.11 秒内分解 90%,在 800 ℃ 时 0.55 × 10-3 秒内分解 90%。在 600 °C 时,随着总压的降低,Si2Cl6 随时间变化的热解比率变大。另一方面,在 800 ℃ 时,无论总压如何,该比率几乎相同。这些结果有助于优化使用 Si2Cl6 的 CVD 工艺条件。
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Theoretical study of the gas-phase reaction of hexachlorodisilane by thermodynamic analysis and kinetics calculation
We conducted thermodynamic analysis and kinetics calculations for hexachlorodisilane (Si2Cl6), which is used as source gas for the CVD of silicon nitride films. Thermodynamic analysis clarified Si2Cl6 decomposes almost completely to SiCl4 and SiCl2 in the range of 600 °C–1100 °C under equilibrium condition. Therefore, it is estimated that the main gas-phase reaction of Si2Cl6 is represented by the reaction Si2Cl6 → SiCl4 + SiCl2. Thermodynamic analysis also shows that the Si2Cl6 system has a larger equilibrium partial pressure of SiCl2 than SiHxCl4-x (x = 1 ~ 3) systems. Kinetics calculations revealed Si2Cl6 decomposes by 90% in 0.11 s at 600 °C, and 0.55 × 10−3 s at 800 °C, respectively. The time-dependent pyrolysis ratio of Si2Cl6 becomes larger as the total pressure decreases at 600 °C. On the other hand, the ratio is almost the same regardless of total pressure at 800 °C. These results will help optimize CVD process conditions using Si2Cl6.
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来源期刊
Japanese Journal of Applied Physics
Japanese Journal of Applied Physics 物理-物理:应用
CiteScore
3.00
自引率
26.70%
发文量
818
审稿时长
3.5 months
期刊介绍: The Japanese Journal of Applied Physics (JJAP) is an international journal for the advancement and dissemination of knowledge in all fields of applied physics. JJAP is a sister journal of the Applied Physics Express (APEX) and is published by IOP Publishing Ltd on behalf of the Japan Society of Applied Physics (JSAP). JJAP publishes articles that significantly contribute to the advancements in the applications of physical principles as well as in the understanding of physics in view of particular applications in mind. Subjects covered by JJAP include the following fields: • Semiconductors, dielectrics, and organic materials • Photonics, quantum electronics, optics, and spectroscopy • Spintronics, superconductivity, and strongly correlated materials • Device physics including quantum information processing • Physics-based circuits and systems • Nanoscale science and technology • Crystal growth, surfaces, interfaces, thin films, and bulk materials • Plasmas, applied atomic and molecular physics, and applied nuclear physics • Device processing, fabrication and measurement technologies, and instrumentation • Cross-disciplinary areas such as bioelectronics/photonics, biosensing, environmental/energy technologies, and MEMS
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