{"title":"用于金属涂层孔隙率分析的凹点研磨与光学显微镜联用技术","authors":"H. Hu , A. He , D. Aasen , S. Shukla , D.G. Ivey","doi":"10.1016/j.micron.2024.103593","DOIUrl":null,"url":null,"abstract":"<div><p>Dimple grinding is one of the steps used in a common method of preparing samples for transmission electron microscopy (TEM); the TEM sample preparation process also involves ion beam sputtering after the dimpling stage. During dimpling, a spherical depression is machined into the sample, leaving a thicker rim to support and facilitate sample handling. In this paper, an alternative application for dimple grinding is developed; dimple grinding combined with optical microscopy is utilized to quantify internal porosity present within coatings. This technique essentially permits three dimensional porosity quantification across the coating thickness using a simple polishing method which provides analysis of areas larger than those observed during standard cross sectional microscopy. The application of this technique to nine electroless nickel-phosphorus (Ni-P) coatings deposited on Mg substrates is demonstrated. An analysis linking medium P content in the Ni-P coatings and high coating thickness to lower porosity is also performed. The lowest porosity was observed for medium P content coatings (5.2 wt% P), while the largest porosity occurred for the high P content coatings (10.0 wt% P). Porosity levels decreased continuously with increasing coating thickness (from 28 µm to 57 µm).</p></div>","PeriodicalId":18501,"journal":{"name":"Micron","volume":null,"pages":null},"PeriodicalIF":2.5000,"publicationDate":"2024-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S0968432824000106/pdfft?md5=3bdf3d94a7ab2c02afc43aa20eb7231d&pid=1-s2.0-S0968432824000106-main.pdf","citationCount":"0","resultStr":"{\"title\":\"Dimple Grinding Coupled with Optical Microscopy for Porosity Analysis of Metallic Coatings\",\"authors\":\"H. Hu , A. He , D. Aasen , S. Shukla , D.G. Ivey\",\"doi\":\"10.1016/j.micron.2024.103593\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Dimple grinding is one of the steps used in a common method of preparing samples for transmission electron microscopy (TEM); the TEM sample preparation process also involves ion beam sputtering after the dimpling stage. During dimpling, a spherical depression is machined into the sample, leaving a thicker rim to support and facilitate sample handling. In this paper, an alternative application for dimple grinding is developed; dimple grinding combined with optical microscopy is utilized to quantify internal porosity present within coatings. This technique essentially permits three dimensional porosity quantification across the coating thickness using a simple polishing method which provides analysis of areas larger than those observed during standard cross sectional microscopy. The application of this technique to nine electroless nickel-phosphorus (Ni-P) coatings deposited on Mg substrates is demonstrated. An analysis linking medium P content in the Ni-P coatings and high coating thickness to lower porosity is also performed. The lowest porosity was observed for medium P content coatings (5.2 wt% P), while the largest porosity occurred for the high P content coatings (10.0 wt% P). Porosity levels decreased continuously with increasing coating thickness (from 28 µm to 57 µm).</p></div>\",\"PeriodicalId\":18501,\"journal\":{\"name\":\"Micron\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.5000,\"publicationDate\":\"2024-01-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://www.sciencedirect.com/science/article/pii/S0968432824000106/pdfft?md5=3bdf3d94a7ab2c02afc43aa20eb7231d&pid=1-s2.0-S0968432824000106-main.pdf\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Micron\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0968432824000106\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MICROSCOPY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Micron","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0968432824000106","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MICROSCOPY","Score":null,"Total":0}
引用次数: 0
摘要
点阵研磨是透射电子显微镜(TEM)样品制备常用方法中的一个步骤;TEM 样品制备过程还包括在点阵阶段之后进行离子束溅射。在磨点过程中,会在样品上加工出一个球形凹陷,留下一个较厚的边缘,以支撑和方便样品的处理。本文开发了凹点研磨的另一种应用;凹点研磨与光学显微镜相结合,用于量化涂层内部的孔隙率。这项技术主要是利用简单的抛光方法,对涂层厚度上的三维孔隙率进行量化,其分析区域大于标准横截面显微镜观察到的区域。该技术应用于九种沉积在镁基底上的无电解镍磷(Ni-P)涂层。此外,还分析了 Ni-P 涂层中中等 P 含量和高涂层厚度与较低孔隙率之间的关系。中等 P 含量涂层(5.2 wt% P)的孔隙率最低,而高 P 含量涂层(10.0 wt% P)的孔隙率最大。随着涂层厚度的增加(从 28 微米到 57 微米),孔隙率水平不断下降。
Dimple Grinding Coupled with Optical Microscopy for Porosity Analysis of Metallic Coatings
Dimple grinding is one of the steps used in a common method of preparing samples for transmission electron microscopy (TEM); the TEM sample preparation process also involves ion beam sputtering after the dimpling stage. During dimpling, a spherical depression is machined into the sample, leaving a thicker rim to support and facilitate sample handling. In this paper, an alternative application for dimple grinding is developed; dimple grinding combined with optical microscopy is utilized to quantify internal porosity present within coatings. This technique essentially permits three dimensional porosity quantification across the coating thickness using a simple polishing method which provides analysis of areas larger than those observed during standard cross sectional microscopy. The application of this technique to nine electroless nickel-phosphorus (Ni-P) coatings deposited on Mg substrates is demonstrated. An analysis linking medium P content in the Ni-P coatings and high coating thickness to lower porosity is also performed. The lowest porosity was observed for medium P content coatings (5.2 wt% P), while the largest porosity occurred for the high P content coatings (10.0 wt% P). Porosity levels decreased continuously with increasing coating thickness (from 28 µm to 57 µm).
期刊介绍:
Micron is an interdisciplinary forum for all work that involves new applications of microscopy or where advanced microscopy plays a central role. The journal will publish on the design, methods, application, practice or theory of microscopy and microanalysis, including reports on optical, electron-beam, X-ray microtomography, and scanning-probe systems. It also aims at the regular publication of review papers, short communications, as well as thematic issues on contemporary developments in microscopy and microanalysis. The journal embraces original research in which microscopy has contributed significantly to knowledge in biology, life science, nanoscience and nanotechnology, materials science and engineering.