{"title":"对布劳诺维奇和亚历山德罗夫 1994 年关于铝铜电气界面金属间化合物的文章的更正","authors":"A. Elkjaer","doi":"10.1557/s43579-024-00516-9","DOIUrl":null,"url":null,"abstract":"<h3 data-test=\"abstract-sub-heading\">Abstract</h3><p>Interest in aluminium and copper joining processes has increased in recent years due to the growing appeal of using aluminium in electrical applications. Braunovic & Alexandrov’s 1994 article, <i>Intermetallic Compounds at Aluminum-to-Copper Electrical Interfaces: Effect of Temperature and Electric Current</i>, has become a seminal contribution on Al-Cu joining for electrical applications. Their detailed measurements of resistance and intermetallic diffusion rates have become a baseline for assessing the operational performance of Al-Cu joints. The paper has had an increasing citation rate since publication and is in multiple electrical contacts textbooks. However, a minor error has been discovered in the presented analysis. In this short communication, the error is identified and a corrected analysis is provided. The corrected analysis shows that Al-Cu intermetallic growth is ten times slower than previously presented. The corrected analysis has a consequential impact on the utility of Al-Cu joints in electrical applications. Therefore, highlighting the error provides valuable insight for utilising and developing Al-Cu welding in electrical applications.</p><h3 data-test=\"abstract-sub-heading\">Graphical abstract</h3>\n","PeriodicalId":19016,"journal":{"name":"MRS Communications","volume":"153 1","pages":""},"PeriodicalIF":1.8000,"publicationDate":"2024-01-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Correction to Braunovic & Alexandrov’s 1994 article on intermetallic compounds at aluminum-to-copper electrical interfaces\",\"authors\":\"A. Elkjaer\",\"doi\":\"10.1557/s43579-024-00516-9\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<h3 data-test=\\\"abstract-sub-heading\\\">Abstract</h3><p>Interest in aluminium and copper joining processes has increased in recent years due to the growing appeal of using aluminium in electrical applications. Braunovic & Alexandrov’s 1994 article, <i>Intermetallic Compounds at Aluminum-to-Copper Electrical Interfaces: Effect of Temperature and Electric Current</i>, has become a seminal contribution on Al-Cu joining for electrical applications. Their detailed measurements of resistance and intermetallic diffusion rates have become a baseline for assessing the operational performance of Al-Cu joints. The paper has had an increasing citation rate since publication and is in multiple electrical contacts textbooks. However, a minor error has been discovered in the presented analysis. In this short communication, the error is identified and a corrected analysis is provided. The corrected analysis shows that Al-Cu intermetallic growth is ten times slower than previously presented. The corrected analysis has a consequential impact on the utility of Al-Cu joints in electrical applications. Therefore, highlighting the error provides valuable insight for utilising and developing Al-Cu welding in electrical applications.</p><h3 data-test=\\\"abstract-sub-heading\\\">Graphical abstract</h3>\\n\",\"PeriodicalId\":19016,\"journal\":{\"name\":\"MRS Communications\",\"volume\":\"153 1\",\"pages\":\"\"},\"PeriodicalIF\":1.8000,\"publicationDate\":\"2024-01-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"MRS Communications\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1557/s43579-024-00516-9\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"MRS Communications","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1557/s43579-024-00516-9","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Correction to Braunovic & Alexandrov’s 1994 article on intermetallic compounds at aluminum-to-copper electrical interfaces
Abstract
Interest in aluminium and copper joining processes has increased in recent years due to the growing appeal of using aluminium in electrical applications. Braunovic & Alexandrov’s 1994 article, Intermetallic Compounds at Aluminum-to-Copper Electrical Interfaces: Effect of Temperature and Electric Current, has become a seminal contribution on Al-Cu joining for electrical applications. Their detailed measurements of resistance and intermetallic diffusion rates have become a baseline for assessing the operational performance of Al-Cu joints. The paper has had an increasing citation rate since publication and is in multiple electrical contacts textbooks. However, a minor error has been discovered in the presented analysis. In this short communication, the error is identified and a corrected analysis is provided. The corrected analysis shows that Al-Cu intermetallic growth is ten times slower than previously presented. The corrected analysis has a consequential impact on the utility of Al-Cu joints in electrical applications. Therefore, highlighting the error provides valuable insight for utilising and developing Al-Cu welding in electrical applications.
期刊介绍:
MRS Communications is a full-color, high-impact journal focused on rapid publication of completed research with broad appeal to the materials community. MRS Communications offers a rapid but rigorous peer-review process and time to publication. Leveraging its access to the far-reaching technical expertise of MRS members and leading materials researchers from around the world, the journal boasts an experienced and highly respected board of principal editors and reviewers.