3D 打印速调管电路的射频特性

Charlotte Wehner, Brad Shirley, Garrett Mathesen, Julian Merrick, Brandon Weatherford, E. Nanni
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引用次数: 0

摘要

有源射频器件(如 klystrons)的制造以昂贵而耗时的机械加工和钎焊周期为主。在这篇文章中,我们描述了采用新型增材制造工艺制造的 X 波段速调管腔体和集成电路的射频特性。零件采用直接金属激光烧结技术用 316 L 不锈钢三维打印,电镀铜,并在一个简单的钎焊周期内完成钎焊。在整个制造过程中,对独立测试腔和集成电路腔进行了测量。未经调谐的腔体频率变化不到预定频率的 5%,Q 值达到 1200 以上。进行了调谐研究,未优化的调谐引脚在不影响 Q 值的情况下实现了 138 MHz 的调谐范围。这些结果表明,这种工艺有望用于廉价、快速地制造新一代高度集成的高功率真空器件。
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Radio Frequency Properties of a 3D Printed Klystron Circuit
The manufacturing of active RF devices like klystrons is dominated by expensive and time-consuming cycles of machining and brazing. In this article, we characterize the RF properties of X-band klystron cavities and an integrated circuit manufactured with a novel additive manufacturing process. Parts are 3D printed in 316 L stainless steel with direct metal laser sintering, electroplated in copper, and brazed in one simple braze cycle. Stand-alone test cavities and integrated circuit cavities were measured throughout the manufacturing process. The un-tuned cavity frequency varies by less than 5% of the intended frequency, and Q factors reach above 1200. A tuning study was performed, and unoptimized tuning pins achieved a tuning range of 138 MHz without compromising Q. Klystron system performance was simulated with as-built cavity parameters and realistic tuning. Together, these results show promise that this process can be used to cheaply and quickly manufacture a new generation of highly integrated high power vacuum devices.
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