高精度光电封装平台的正向运动学分析

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Packaging Pub Date : 2024-02-09 DOI:10.1115/1.4064704
Ziyang Wang, Haibo Zhou, Linjiao Xiao, Lian Duan
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引用次数: 0

摘要

为了满足光电封装平台高精度运动控制的要求,我们提出了一种改进的粒子群优化和反向传播(IPSO-BP)神经网络,用于解决平台的正向运动学问题(FKP)。本文的重点是光电封装中常用的 6-pss 柔性并联平台。首先,利用几何和矢量分析解决了基于柔性矩阵的平台逆运动学问题(IKP)。然后,利用统一设计(UD)、随机学习策略和 FKP 中的空间缩小技术对传统 PSO-BP 网络进行优化。最后,模拟和实验证明,在高精度光电封装平台上求解 FKP 的 IPSO-BP 网络是可行的。与 BP 和 PSO-BP 相比,该网络具有更高的分辨率、更快的收敛速度以及亚微米级的误差控制,满足了平台在微米级的 运动控制要求。这项研究为生产高质量的光电封装器件奠定了坚实的基础。
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Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platform
To meet the requirements of high-precision motion control for optoelectronic packaging platforms, we propose an improved particle swarm optimization and backpropagation (IPSO-BP) neural network for solving the forward kinematics problem (FKP) of platforms. The focus of this paper is the 6-pss flexible parallel platform commonly used in optoelectronic packaging. First, a platform inverse kinematics problem (IKP) based on a flexibility matrix is solved using geometric and vector analysis. The conventional PSO-BP network is then optimized utilizing uniform design (UD), a random learning strategy, and space reduction techniques in FKP. Finally, simulations and experiments demonstrate that the proposed IPSO-BP network for solving the FKP on high-precision optoelectronic packaging platforms is feasible. Compared to BP and PSO-BP, this network has a higher resolution, faster convergence speed, and error control at the submicron level, which satisfies the motion control requirements of the platform at the micron level. This study lays a solid foundation for the production of high-quality devices in optoelectronic packaging.
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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