R. Asanovski , A. Grill , J. Franco , P. Palestri , H. Mertens , R. Ritzenthaler , N. Horiguchi , B. Kaczer , L. Selmi
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引用次数: 0
摘要
通过在 300 K 至 4 K 的宽温度范围内进行测量,研究了 800 个并联叉片 MOSFET 阵列的直流和低频噪声性能。阵列结构允许测量器件的代表性平均性能,并为 1/f 噪声分析提供了较大的有效面积。结果表明,从室温到低温时,饱和漏极电流有所改善,阈下摆幅在 100 K 左右达到饱和,阈值电压变化了约 150 mV,这与硅低温电子器件中观察到的趋势相似。此外,研究还证实,低温下的噪声并不遵循通常假设的随温度变化的线性比例。这种与线性比例的偏差与块体和硅-绝缘体(SOI)器件界面上存在的尾态有关。这些结果表明,这种先进器件结构中过量的 1/f 噪声与器件结构无关,而是与半导体/电介质界面的微观材料特性有关。
Characterization of DC performance and low-frequency noise of an array of nMOS Forksheets from 300 K to 4 K
The DC and low-frequency noise performance of an array of 800 parallel Forksheet MOSFETs were investigated by performing measurements over a wide temperature range from 300 K to 4 K. The array structure allowed to measure a representative average performance of the devices and provided a large effective area for 1/f noise analysis. Results showed an improvement in the saturation drain current when going from room temperature to cryogenic temperatures, with the subthreshold swing saturating around 100 K and the threshold voltage shifting by approximately 150 mV, following similar trends observed in Silicon cryogenic electronics. Additionally, the study confirms that the noise at cryogenic temperatures does not follow the commonly assumed linear scaling with temperature. This deviation from the linear scaling has been associated with the presence of tail states at the interface in bulk and silicon-on-insulator (SOI) devices. These results suggest that the excess 1/f noise in this advanced device architecture is not related to the device architecture but rather to the microscopic material properties of semiconductor/dielectric interfaces.
期刊介绍:
It is the aim of this journal to bring together in one publication outstanding papers reporting new and original work in the following areas: (1) applications of solid-state physics and technology to electronics and optoelectronics, including theory and device design; (2) optical, electrical, morphological characterization techniques and parameter extraction of devices; (3) fabrication of semiconductor devices, and also device-related materials growth, measurement and evaluation; (4) the physics and modeling of submicron and nanoscale microelectronic and optoelectronic devices, including processing, measurement, and performance evaluation; (5) applications of numerical methods to the modeling and simulation of solid-state devices and processes; and (6) nanoscale electronic and optoelectronic devices, photovoltaics, sensors, and MEMS based on semiconductor and alternative electronic materials; (7) synthesis and electrooptical properties of materials for novel devices.