电介质击穿随时间变化的聚类模型 SPICE 仿真

IF 1.4 4区 物理与天体物理 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Solid-state Electronics Pub Date : 2024-03-07 DOI:10.1016/j.sse.2024.108895
E. Salvador, R. Rodriguez, E. Miranda
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引用次数: 0

摘要

在这封信中,我们报告了一种在 SPICE 仿真框架内处理 MOS 和 MIM 结构中氧化层随时间变化的介质击穿 (TDDB) 的方法。我们特别关注介质击穿的聚类模型(Burr's XII 分布),该模型可视为众所周知的 Weibull 模型的扩展。这两种模型的氧化物击穿时间都是通过累积分布函数的反演方法计算得出的。为完整起见,建议的方法包括初始和最终电阻状态的非相关变异性。为了说明问题,还展示了如何在模拟参数中引入电压加速、逐步击穿或任何其他相关因素。作为一个应用实例,所提出的方法用于模拟基于 NMOS 的逆变器电路的栅极到漏极电介质击穿的最简单情况。
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SPICE simulation of the time-dependent clustering model for dielectric breakdown

In this letter, a method for dealing with the time-dependent dielectric breakdown (TDDB) of oxide layers in MOS and MIM structures in the framework of SPICE simulations is reported. In particular, we focus the attention on the clustering model (Burr’s XII distribution) for dielectric breakdown which can be considered an extension of the well known Weibull model. The oxide time-to-breakdown for both models is calculated using the inversion method for the cumulative distribution function. For the sake of completeness, the proposed approach includes uncorrelated variability both in the initial and final resistance states. For illustrative purposes, it is also shown how voltage acceleration, progressive breakdown or any other correlation factor can be introduced in the simulation parameters. As an application example, the proposed method is used to simulate the simplest case of a gate-to-drain dielectric breakdown of a NMOS-based inverter circuit.

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来源期刊
Solid-state Electronics
Solid-state Electronics 物理-工程:电子与电气
CiteScore
3.00
自引率
5.90%
发文量
212
审稿时长
3 months
期刊介绍: It is the aim of this journal to bring together in one publication outstanding papers reporting new and original work in the following areas: (1) applications of solid-state physics and technology to electronics and optoelectronics, including theory and device design; (2) optical, electrical, morphological characterization techniques and parameter extraction of devices; (3) fabrication of semiconductor devices, and also device-related materials growth, measurement and evaluation; (4) the physics and modeling of submicron and nanoscale microelectronic and optoelectronic devices, including processing, measurement, and performance evaluation; (5) applications of numerical methods to the modeling and simulation of solid-state devices and processes; and (6) nanoscale electronic and optoelectronic devices, photovoltaics, sensors, and MEMS based on semiconductor and alternative electronic materials; (7) synthesis and electrooptical properties of materials for novel devices.
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