揭示基于 Hf0.5Zr0.5O2 的铁电栅极堆栈的负电容效应背后的机理,并引入漏电感知 NCFET 的电路兼容混合紧凑模型

IF 1.4 4区 物理与天体物理 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Solid-state Electronics Pub Date : 2024-03-30 DOI:10.1016/j.sse.2024.108932
Khoirom Johnson Singh, Lomash Chandra Acharya, Anand Bulusu, Sudeb Dasgupta
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引用次数: 0

摘要

本文针对人们对氧化铪锆(HZO)铁电(FE)栅堆负电容(NC)效应的起源缺乏了解的问题,提出了一种新的电路兼容的 NC 场效应晶体管(NCFET)混合紧凑模型。该模型支持 Landau 和 Preisach FE 模型,包含多个 FE 域、FE 泄漏和 FE 阻尼。实验验证了所提出的模型,并预测了 HZO 的本征开关速度。结果表明,HZO 中的 NC 效应源于自由电荷和极化开关速率的不匹配。模型的性能评估显示,与 PZT-NCFET 相比,HZO-NCFET 在低频和高频的放大率分别提高了 1.18 倍和 9.17 倍。我们的研究表明,工程漏电-HZO NCFET 的导通电流(2.74 mA/µm)非常出色,分别是 FinFET 和锗源 L 型 TFET 的 7.89 倍和∼4.81 倍。本研究简要探讨了朗道 NCFET 中负漏极诱导的势垒降低效应和负微分电阻效应的直接原因。此外,我们还强调了 FE 厚度在决定 NC 效应大小中的关键作用,为基于 NC 的器件和电路的设计与优化提供了宝贵的见解。对基于 NCFET 的逆变器中米勒效应的分析表明,由于高导通电流和电压放大效应,逆变器的性能得到了显著改善,使其适用于基于 NCFET 的高速电路。与基于 NC 纳米线场效应晶体管的逆变器相比,基于 Landau 和 Preisach NCFET 的逆变器的过冲较低,分别为 50.70% 和 51.34%,传播延迟较低,分别为 28.45% 和 28.61%。此外,与基于 CMOS FET 的电路相比,基于 NCFET 的 2:1 叉电路显著降低了(46.69%,51.37%)临界时钟偏移,展示了 NCFET 技术在解决随机逻辑路径中时序违规问题方面的潜力。此外,与最先进的石墨烯 FET-RO 和 CMOS-RO 相比,基于 Landau 和 Preisach NCFET 的环形振荡器(RO)分别实现了 (39.97%, 49.38%) 和 (52.65%, 62.92%) 更高的振荡频率 (fOSC)。15级Leaky-HZO和Engineered Leaky-HZO NCFET-RO的fOSC分别比双栅极FET-RO高出2.19倍和16.69倍,凸显了它们在频域指标方面的卓越性能。这些发现证明了基于 NCFET 的数字和混合信号电路在高性能集成电路设计中的潜力。
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Unveiling the mechanism behind the negative capacitance effect in Hf0.5Zr0.5O2-Based ferroelectric gate stacks and introducing a Circuit-Compatible hybrid compact model for Leakage-Aware NCFETs

This paper addresses the lack of understanding of the origin of negative capacitance (NC) effect in the hafnium zirconium oxide (HZO) ferroelectric (FE) gate stack and proposes a new circuit-compatible hybrid compact model for NC field-effect transistors (NCFETs). The model supports Landau and Preisach FE models, encompassing multiple FE domains, FE leakage, and FE damping. The proposed model is experimentally validated, and the intrinsic switching speed of HZO is predicted. It is revealed that the NC effect in HZO stems from a mismatch in free charge and polarization switching rates. Performance evaluation of the model reveals that HZO-NCFET achieves ∼1.18x and ∼9.17x higher amplification at low and high frequencies compared to its PZT-NCFET counterpart. Our study demonstrates the superior ON-current (2.74 mA/µm) of the Engineered Leaky-HZO NCFET, surpassing FinFET and Germanium-source L-shaped TFET by ∼7.89x and ∼4.81x, respectively. This study briefly examines the direct causes of the negative drain-induced barrier lowering effect and negative differential resistance effect in Landau NCFETs. Furthermore, we emphasize the crucial role of FE thickness in determining the magnitude of the NC effect, offering valuable insights for the design and optimization of NC-based devices and circuits. Analysis of the Miller effect in NCFET-based inverters demonstrates significant improvements owing to high ON-current and voltage amplification, making them suitable for high-speed NCFET-based circuitry. Landau and Preisach NCFET-based inverters exhibit (50.70%, 51.34%) lower overshoots and (28.45%, 28.61%) reduced propagation delay compared to the NC nanowire FET-based inverter. Moreover, NCFET-based 2:1 fork circuits significantly reduce (46.69%, 51.37%) critical clock skew compared to CMOS FET-based circuits, showcasing the potential of NCFET technology in addressing timing violations in random logic paths. Furthermore, the Landau and Preisach NCFET-based ring oscillators (ROs) achieve (39.97%, 49.38%) and (52.65%, 62.92%) higher oscillation frequencies (fOSC) compared to state-of-the-art graphene FET-RO and CMOS-RO, respectively. The 15-stage Leaky-HZO and Engineered Leaky-HZO NCFET-ROs outperform the double gate-FET-RO by ∼2.19x and ∼16.69x in terms of fOSC, highlighting their superior performance in frequency-domain metrics. These findings demonstrate the potential of NCFET-based digital and mixed-signal circuits for high-performance integrated circuit designs.

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来源期刊
Solid-state Electronics
Solid-state Electronics 物理-工程:电子与电气
CiteScore
3.00
自引率
5.90%
发文量
212
审稿时长
3 months
期刊介绍: It is the aim of this journal to bring together in one publication outstanding papers reporting new and original work in the following areas: (1) applications of solid-state physics and technology to electronics and optoelectronics, including theory and device design; (2) optical, electrical, morphological characterization techniques and parameter extraction of devices; (3) fabrication of semiconductor devices, and also device-related materials growth, measurement and evaluation; (4) the physics and modeling of submicron and nanoscale microelectronic and optoelectronic devices, including processing, measurement, and performance evaluation; (5) applications of numerical methods to the modeling and simulation of solid-state devices and processes; and (6) nanoscale electronic and optoelectronic devices, photovoltaics, sensors, and MEMS based on semiconductor and alternative electronic materials; (7) synthesis and electrooptical properties of materials for novel devices.
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