Kelvin J. Nicholson , Ellen Gupta , Colin Bonner , Theodore Fessaras , Mark Mirotznik
{"title":"用于超表面天线的工程基底","authors":"Kelvin J. Nicholson , Ellen Gupta , Colin Bonner , Theodore Fessaras , Mark Mirotznik","doi":"10.1016/j.addlet.2024.100212","DOIUrl":null,"url":null,"abstract":"<div><p>This letter explores the advantages of additively manufactured substrates with spatially varying electromagnetic properties. These engineered substrates will be constructed using space filling curves (SFC) of various orders. New advanced manufacturing systems such as the nScrypt 3Dn-300, have enabled the rapid fabrication of these SFC substrates. This letter will apply the engineered SFC substrate to the design and fabrication of metasurface antennas. By utilising a SFC to vary the local substrate permittivity, along with the printed conductive patch dimensions, the range of achievable surface impedances can be greatly expanded. This enlarged design space will be leveraged to yield increased gain for a given metasurface antenna size. Methods to characterise the substrate permittivity and conductive ink are discussed along with a complete description of the metasurface antenna design, fabrication and validation process.</p></div>","PeriodicalId":72068,"journal":{"name":"Additive manufacturing letters","volume":null,"pages":null},"PeriodicalIF":4.2000,"publicationDate":"2024-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2772369024000215/pdfft?md5=42b7294ab4e1abb7c0ad8285e36f3290&pid=1-s2.0-S2772369024000215-main.pdf","citationCount":"0","resultStr":"{\"title\":\"Engineered substrates for metasurface antennas\",\"authors\":\"Kelvin J. Nicholson , Ellen Gupta , Colin Bonner , Theodore Fessaras , Mark Mirotznik\",\"doi\":\"10.1016/j.addlet.2024.100212\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>This letter explores the advantages of additively manufactured substrates with spatially varying electromagnetic properties. These engineered substrates will be constructed using space filling curves (SFC) of various orders. New advanced manufacturing systems such as the nScrypt 3Dn-300, have enabled the rapid fabrication of these SFC substrates. This letter will apply the engineered SFC substrate to the design and fabrication of metasurface antennas. By utilising a SFC to vary the local substrate permittivity, along with the printed conductive patch dimensions, the range of achievable surface impedances can be greatly expanded. This enlarged design space will be leveraged to yield increased gain for a given metasurface antenna size. Methods to characterise the substrate permittivity and conductive ink are discussed along with a complete description of the metasurface antenna design, fabrication and validation process.</p></div>\",\"PeriodicalId\":72068,\"journal\":{\"name\":\"Additive manufacturing letters\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":4.2000,\"publicationDate\":\"2024-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://www.sciencedirect.com/science/article/pii/S2772369024000215/pdfft?md5=42b7294ab4e1abb7c0ad8285e36f3290&pid=1-s2.0-S2772369024000215-main.pdf\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Additive manufacturing letters\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S2772369024000215\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, MANUFACTURING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Additive manufacturing letters","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2772369024000215","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
This letter explores the advantages of additively manufactured substrates with spatially varying electromagnetic properties. These engineered substrates will be constructed using space filling curves (SFC) of various orders. New advanced manufacturing systems such as the nScrypt 3Dn-300, have enabled the rapid fabrication of these SFC substrates. This letter will apply the engineered SFC substrate to the design and fabrication of metasurface antennas. By utilising a SFC to vary the local substrate permittivity, along with the printed conductive patch dimensions, the range of achievable surface impedances can be greatly expanded. This enlarged design space will be leveraged to yield increased gain for a given metasurface antenna size. Methods to characterise the substrate permittivity and conductive ink are discussed along with a complete description of the metasurface antenna design, fabrication and validation process.
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