A vibrating membrane ejector for direct ink writing of printed electronics

Direct ink writing (DIW) represents a technical branch of additive manufacturing technology, particularly suitable for prototyping or small-batch printing production of printed electronic components. However, the existing print heads required for near or sub-100 μm line width are quite sophisticated, limiting the accessibility and application of the DIW method. This paper reports the use of the vibrating membrane ejector (VME) as a new option for the print head of DIW. The structure of the VME-based print head was specially designed for this purpose. Finite element modeling and analysis of the VME’s vibration characteristics were performed to provide insights into the ejection conditions and behaviors. The factors influencing the size of printed structures were identified and analyzed through the printing of a metal–organic complex silver (Ag) ink. After optimizing several operational parameters to limit the spreading effects and suppress the satellite droplets, the DIW printed line width has reached about 100 μm. The effectiveness of the VME-based print head was further demonstrated through the DIW fabrication of interdigitated electrodes and microstrip transmission lines. This highlights the versatility of the VME-based print head as a practical tool for device prototyping and ink development in the field of printed electronics.