Dry printing fully functional eco-friendly and disposable transient papertronics

IF 2.8 4区 工程技术 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY Flexible and Printed Electronics Pub Date : 2024-08-29 DOI:10.1088/2058-8585/ad70c5
Adib Taba, Aarsh Patel, Masoud Mahjouri-Samani
{"title":"Dry printing fully functional eco-friendly and disposable transient papertronics","authors":"Adib Taba, Aarsh Patel, Masoud Mahjouri-Samani","doi":"10.1088/2058-8585/ad70c5","DOIUrl":null,"url":null,"abstract":"The demand for flexible printed electronics is growing fast, especially with the move toward the Internet of Things. These printed electrons are usually designed for short-term use, after which they are disposed of. The polymeric substrates used in printed electronics comprise the biggest portion of their non-biodegradable E-waste after their disposal. This paper demonstrates the feasibility of printing fully functional transient electronics on flexible, water-soluble, and biodegradable paper substrates using the dry printing approach. The <italic toggle=\"yes\">in-situ</italic> generation and real-time sintering of silver nanoparticles at room temperature enables the fabrication of complex circuits on such water-soluble papers. A layout similar to an Arduino pro mini board is printed on both sides of a paper substrate with electrical interconnects. Various electrical components are then directly mounted to fabricate a complete, working paper Arduino circuit. Cyclic bending tests demonstrate the mechanical durability and reliability of printed paper circuits under repeated bending stress. The process uniquely achieves robust and complex printed electronics without thermal damage, and the water solubility tests successfully show rapid dissolution of the paper devices in water. Furthermore, the components detached during dissolution are collected and reused, demonstrating the recyclability of the process. Overall, this transformative manufacturing method establishes key technical capabilities to produce next-generation sustainable, green electronics and sensors using renewable materials.","PeriodicalId":51335,"journal":{"name":"Flexible and Printed Electronics","volume":"9 1","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2024-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Flexible and Printed Electronics","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1088/2058-8585/ad70c5","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0

Abstract

The demand for flexible printed electronics is growing fast, especially with the move toward the Internet of Things. These printed electrons are usually designed for short-term use, after which they are disposed of. The polymeric substrates used in printed electronics comprise the biggest portion of their non-biodegradable E-waste after their disposal. This paper demonstrates the feasibility of printing fully functional transient electronics on flexible, water-soluble, and biodegradable paper substrates using the dry printing approach. The in-situ generation and real-time sintering of silver nanoparticles at room temperature enables the fabrication of complex circuits on such water-soluble papers. A layout similar to an Arduino pro mini board is printed on both sides of a paper substrate with electrical interconnects. Various electrical components are then directly mounted to fabricate a complete, working paper Arduino circuit. Cyclic bending tests demonstrate the mechanical durability and reliability of printed paper circuits under repeated bending stress. The process uniquely achieves robust and complex printed electronics without thermal damage, and the water solubility tests successfully show rapid dissolution of the paper devices in water. Furthermore, the components detached during dissolution are collected and reused, demonstrating the recyclability of the process. Overall, this transformative manufacturing method establishes key technical capabilities to produce next-generation sustainable, green electronics and sensors using renewable materials.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
干式印刷全功能环保型一次性瞬态纸张电子元件
对柔性印刷电子产品的需求正在快速增长,特别是随着物联网的发展。这些印刷电子产品通常是为短期使用而设计的,之后就会被丢弃。印刷电子产品中使用的聚合物基底在废弃后的不可生物降解电子垃圾中占最大比例。本文展示了利用干式印刷方法在柔性、水溶性和可生物降解的纸质基底上印刷全功能瞬态电子器件的可行性。银纳米粒子在室温下的原位生成和实时烧结使得在这种水溶性纸张上制造复杂电路成为可能。类似于 Arduino pro 迷你电路板的布局被印刷在纸基板的两面,并带有电气互连。然后直接安装各种电气元件,制作出一个完整的、可工作的纸质 Arduino 电路。循环弯曲测试证明了印刷纸电路在反复弯曲应力下的机械耐久性和可靠性。该工艺独特地实现了坚固而复杂的印刷电子元件,且不会产生热损伤,水溶性测试成功显示了纸器件在水中的快速溶解。此外,溶解过程中脱落的元件可以收集起来重新使用,这证明了该工艺的可回收性。总之,这种变革性的制造方法建立了利用可再生材料生产下一代可持续绿色电子器件和传感器的关键技术能力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
Flexible and Printed Electronics
Flexible and Printed Electronics MATERIALS SCIENCE, MULTIDISCIPLINARY-
CiteScore
4.80
自引率
9.70%
发文量
101
期刊介绍: Flexible and Printed Electronics is a multidisciplinary journal publishing cutting edge research articles on electronics that can be either flexible, plastic, stretchable, conformable or printed. Research related to electronic materials, manufacturing techniques, components or systems which meets any one (or more) of the above criteria is suitable for publication in the journal. Subjects included in the journal range from flexible materials and printing techniques, design or modelling of electrical systems and components, advanced fabrication methods and bioelectronics, to the properties of devices and end user applications.
期刊最新文献
Flexible intracortical probes for stable neural recording: from the perspective of structure Dry printing fully functional eco-friendly and disposable transient papertronics End-of-life options for printed electronics in municipal solid waste streams: a review of the challenges, opportunities, and sustainability implications Transparent and flexible fish-tail shaped antenna for ultra-wideband MIMO systems Recent advances in encapsulation strategies for flexible transient electronics
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1