基于偶极子的 BEM 三维内聚裂纹扩展建模方法

IF 2.7 3区 工程技术 Q1 ENGINEERING, MULTIDISCIPLINARY International Journal for Numerical Methods in Engineering Pub Date : 2024-05-30 DOI:10.1002/nme.7535
Luís Philipe Ribeiro Almeida, Edson Denner Leonel
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引用次数: 0

摘要

本研究针对三维结构的内聚裂纹扩展建模提出了一种替代边界元法(BEM)公式。所提出的公式利用初始应力场来表示断裂过程区的机械行为,从而产生一组自平衡力,称为偶极子。材料在断裂过程区的非线性行为受内聚法则的支配。与该领域的经典 BEM 方法相比,基于偶极子的拟议公式具有一些优势。其中值得一提的优点是,每个位于断裂过程区的配位点只需三个积分方程。基于偶极子的计算方法的有效性已通过四个应用得到证实。研究结果与文献中的数值、实验和分析解法进行了比较,结果表明其性能优异。
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Dipole-based BEM formulation for three-dimensional cohesive crack propagation modelling

This study presents an alternative boundary element method (BEM) formulation for the cohesive crack propagation modelling in three-dimensional structures. The proposed formulation utilises an initial stress field for representing the mechanical behaviour along the fracture process zone, which leads to a set of self-equilibrated forces named as dipole. Cohesive laws govern the material nonlinear behaviour along the fracture process zone. The proposed dipole-based formulation demonstrates some advantages in comparison to classical BEM approaches in this field. Among them, it is worth citing the requirement of solely three integral equations per collocation point positioned at the fracture process zone. The effectiveness of the dipole-based formulation has been demonstrated by four applications. The results have been compared to numerical, experimental and analytical solutions available in the literature, in which excellent performance has been observed.

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来源期刊
CiteScore
5.70
自引率
6.90%
发文量
276
审稿时长
5.3 months
期刊介绍: The International Journal for Numerical Methods in Engineering publishes original papers describing significant, novel developments in numerical methods that are applicable to engineering problems. The Journal is known for welcoming contributions in a wide range of areas in computational engineering, including computational issues in model reduction, uncertainty quantification, verification and validation, inverse analysis and stochastic methods, optimisation, element technology, solution techniques and parallel computing, damage and fracture, mechanics at micro and nano-scales, low-speed fluid dynamics, fluid-structure interaction, electromagnetics, coupled diffusion phenomena, and error estimation and mesh generation. It is emphasized that this is by no means an exhaustive list, and particularly papers on multi-scale, multi-physics or multi-disciplinary problems, and on new, emerging topics are welcome.
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