对 "利用集成式单平面紧凑耦合结构和可控传输零点匹配方法抑制微带天线中的超宽带杂散辐射 "的更正

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-06-27 DOI:10.1109/TCPMT.2024.3398908
P. V. Sitaraman;Vamsi Krishna Velidi;Arijit De
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引用次数: 0

摘要

在上述文章[1]中,虽然图 13(b)不存在技术错误,但高亮部分(用洋红色虚线勾勒的矩形区域)和放大图的图示频率范围是不同的。主图的频率范围很宽,从直流到 28 千兆赫。放大部分的频率范围很窄,从 2.9 GHz 到 3.2 GHz。请注意,高亮部分只是一种表示方法,因此放大图的频率范围并不完全相同(一一对应),因为很难在 28 千兆赫的跨度上突出 400 兆赫的范围。
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Corrections to “Ultra-Wideband Spurious Radiation Suppression in Microstrip Antennas Using Integrated Uniplanar Compact Coupling Structure With Controllable Transmission-Zeros Matching Approach”
In the above article [1] , although there is no technical error in Fig. 13(b) , the frequency ranges in the pictorial representation for the highlighted portion (rectangular area outlined by a magenta-colored dotted line) and the zoomed figure are different. The main figure has a very wide frequency range from dc to 28 GHz. The zoomed portion has a very narrow frequency range from 2.9 to 3.2 GHz. Please note that the highlighted portion is just a representation, and hence, the frequency range is not exactly the same (one-to-one) for the zoomed figure, as it is very difficult to highlight a 400-MHz range over a 28-GHz span.
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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