GH4169 柱状缠绕金属丝材料在高温下的压缩蠕变行为

IF 2.7 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY Materials Letters Pub Date : 2024-06-24 DOI:10.1016/j.matlet.2024.136904
Fuqiang Lai, Guilin Gao, Congjian Zhou, Yiwan Wu, Xin Xue
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引用次数: 0

摘要

作为一种镍基合金,GH4169 具有优异的耐腐蚀性、高温抗氧化性和高抗蠕变性。本文研究了金属丝(GH4169 镍基合金和 304 不锈钢)制成的圆柱体缠丝材料(CEWM)在高温(400 ℃ 至 500 ℃)条件下的压缩蠕变行为。通过四个机械性能参数的变化幅度和材料表征方法评估了两种材料的性能退化情况。结果表明,304 CEWM 和 GH4169 CEWM 在高温条件下均出现了明显的性能退化,而且这两种 CEWM 在 450 °C 以上(回火温度)的性能退化更为严重。在测试温度下,与 304 CEWM 相比,GH4169 CEWM 的抗蠕变性更好。因此,结论是 GH4169 CEWM 是一种优秀的材料,可以在高温工作条件下替代常用的 304 CEWM。
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Compression creep behaviors of GH4169 cylinder entangled wire material at elevated temperatures

As a nickel-based alloy, GH4169 has the properties of excellent corrosion resistance, high temperature oxidation resistance and high creep resistance. In this paper, the compression creep behaviors of cylinder entangled wire materials (CEWMs) made from metal wires (GH4169 nickel-based alloy, 304 stainless steel) were investigated at elevated temperatures (from 400 °C to 500 °C). The performance degradation of the two materials was evaluated by the variation amplitude of four mechanical properties parameters and material characterization methods. The results indicated that both of 304 CEWMs and GH4169 CEWMs suffered a significant performance degradation at elevated temperatures, and both of the two CEWMs showed a much serious performance degradation above 450 °C (tempering temperature). Compared to the 304 CEWMs at the tested temperatures, the GH4169 CEWMs obtained better creep resistance. It is therefore concluded that the GH4169 CEWM is an excellent material that can replace the commonly used 304 CEWM at elevated temperature work conditions.

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来源期刊
Materials Letters
Materials Letters 工程技术-材料科学:综合
CiteScore
5.60
自引率
3.30%
发文量
1948
审稿时长
50 days
期刊介绍: Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive
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