用于毫米波无电池物联网应用的带有高效 MMIC F 类负载砷化镓整流器的 3-D 打印多聚焦截断式古特曼透镜

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-06-26 DOI:10.1109/TCPMT.2024.3419712
Wenyi Shao;Bo Yang;Naoki Shinohara
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引用次数: 0

摘要

本文介绍了一种全介质三维打印多聚焦截顶古特曼透镜,该透镜与高效 MMIC F 类负载砷化镓整流器集成,适用于 24 GHz 的毫米波无电池物联网应用。我们利用全波仿真对所提透镜结构的多聚焦性能进行了详细分析,揭示了透镜后表面聚焦光斑的位置随传输光束方向的变化而变化。利用经济高效的三维打印技术,我们在自动堆叠穿孔介质立方体的基础上制造出了截断古特曼透镜原型。我们在 24 GHz 频率下进行了近场相变实验,以验证所制造透镜原型的多聚焦性能。此外,与以往研究中使用电容器的传统整流器不同,我们在24 GHz频率下设计并制作了使用F级负载的单并联全波整流电路的砷化镓MMIC整流器天线,在输入功率为210 mW、电阻负载为120美元(Ω)的情况下,实测最大整流效率达到47.9%。毫米波无线功率传输(WPT)实验通过提高转换效率和降低对入射光束角度的敏感性,进一步证明了所提出的透镜结构在实际毫米波物联网 WPT 应用中的潜力。
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3-D Printed Multifocusing Truncated Gutman Lens With High-Efficient MMIC Class-F Load GaAs Rectenna for mm-Wave Battery-Free IoT Application
We introduce an all-dielectric 3-D-printed multifocusing truncated Gutman lens integrated with a high-efficient MMIC class-F load GaAs rectenna for mm-Wave Battery-free IoT applications at 24 GHz in this article. We conduct a detailed analysis of the multifocusing performance of the proposed lens structure using full-wave simulation, revealing the varying position of the focusing spot on the back surface of lens in response to the transmitted beam direction. Benefiting from the cost-effective 3-D printing technique, we fabricate a truncated Gutman lens prototype based on the automatic stacking of perforated dielectric cubes. The near-field phase transform experiment at 24 GHz was carried out to verify the multifocusing performance of the fabricated lens prototype. In addition, unlike the traditional rectifier using a capacitor in previous studies, we design and fabricate a GaAs MMIC rectenna using a single-shunt full-wave rectifier circuit with an F-class load at 24 GHz, achieving a measured maximum rectification efficiency of 47.9% with an input power of 210 mW and a $120 \, \Omega $ resistive load. The mm-Wave wireless power transfer (WPT) experiment further demonstrates the potential of the proposed lens structure for practical mm-Wave IoT WPT applications by enhancing conversion efficiency and reducing sensitivity to incident beam angles.
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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