Fabien Chevreux, Manon Letiche, Alexey Vorobiev, Max Wolff, Laurent-Luc Chapelon
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Moisture Diffusion in PECVD a-SiOxNy:H and a-SiOx:H Coated on Polymer Resins: A Neutron Reflectometry Study
The uptake of water of as-deposited thin films of SiOxNy and SiOx hard coatings on epoxy polymer resin by PECVD is studied by X-ray photoelectron spectroscopy (XPS) and ToF-SIMS. The absence of a chemical composition gradient at the dielectric-resin interface suggests a rough interface between the two materials. Upon storage in a cleanroom environment for 6 months (19 °C/40% RH), the uptake of water of the polymer resin layer was observed by XPS. Additionally, ToF-SIMS depth profiling revealed significant changes in the water content at the SiOxNy-resin interface. We attribute these changes to the absorption of water diffusing through the dielectric-resin. Neutron reflectometry performed under a dry and D2O atmosphere confirms that D2O was nonreversibly absorbed in the SiOxNy-resin, but only limited moisture diffusion was observed in the SiOx-resin.
期刊介绍：
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
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