Fabien Chevreux, Manon Letiche, Alexey Vorobiev, Max Wolff, Laurent-Luc Chapelon
{"title":"PECVD a-SiOxNy:H 和 a-SiOx:H 涂层聚合物树脂中的水分扩散:中子反射仪研究","authors":"Fabien Chevreux, Manon Letiche, Alexey Vorobiev, Max Wolff, Laurent-Luc Chapelon","doi":"10.1021/acsaelm.4c00239","DOIUrl":null,"url":null,"abstract":"The uptake of water of as-deposited thin films of SiO<sub><i>x</i></sub>N<sub><i>y</i></sub> and SiO<sub><i>x</i></sub> hard coatings on epoxy polymer resin by PECVD is studied by X-ray photoelectron spectroscopy (XPS) and ToF-SIMS. The absence of a chemical composition gradient at the dielectric-resin interface suggests a rough interface between the two materials. Upon storage in a cleanroom environment for 6 months (19 °C/40% RH), the uptake of water of the polymer resin layer was observed by XPS. Additionally, ToF-SIMS depth profiling revealed significant changes in the water content at the SiO<sub><i>x</i></sub>N<sub><i>y</i></sub>-resin interface. We attribute these changes to the absorption of water diffusing through the dielectric-resin. Neutron reflectometry performed under a dry and D<sub>2</sub>O atmosphere confirms that D<sub>2</sub>O was nonreversibly absorbed in the SiO<sub><i>x</i></sub>N<sub><i>y</i></sub>-resin, but only limited moisture diffusion was observed in the SiO<sub><i>x</i></sub>-resin.","PeriodicalId":3,"journal":{"name":"ACS Applied Electronic Materials","volume":null,"pages":null},"PeriodicalIF":4.3000,"publicationDate":"2024-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Moisture Diffusion in PECVD a-SiOxNy:H and a-SiOx:H Coated on Polymer Resins: A Neutron Reflectometry Study\",\"authors\":\"Fabien Chevreux, Manon Letiche, Alexey Vorobiev, Max Wolff, Laurent-Luc Chapelon\",\"doi\":\"10.1021/acsaelm.4c00239\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The uptake of water of as-deposited thin films of SiO<sub><i>x</i></sub>N<sub><i>y</i></sub> and SiO<sub><i>x</i></sub> hard coatings on epoxy polymer resin by PECVD is studied by X-ray photoelectron spectroscopy (XPS) and ToF-SIMS. The absence of a chemical composition gradient at the dielectric-resin interface suggests a rough interface between the two materials. Upon storage in a cleanroom environment for 6 months (19 °C/40% RH), the uptake of water of the polymer resin layer was observed by XPS. Additionally, ToF-SIMS depth profiling revealed significant changes in the water content at the SiO<sub><i>x</i></sub>N<sub><i>y</i></sub>-resin interface. We attribute these changes to the absorption of water diffusing through the dielectric-resin. Neutron reflectometry performed under a dry and D<sub>2</sub>O atmosphere confirms that D<sub>2</sub>O was nonreversibly absorbed in the SiO<sub><i>x</i></sub>N<sub><i>y</i></sub>-resin, but only limited moisture diffusion was observed in the SiO<sub><i>x</i></sub>-resin.\",\"PeriodicalId\":3,\"journal\":{\"name\":\"ACS Applied Electronic Materials\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":4.3000,\"publicationDate\":\"2024-06-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ACS Applied Electronic Materials\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1021/acsaelm.4c00239\",\"RegionNum\":3,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Electronic Materials","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1021/acsaelm.4c00239","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Moisture Diffusion in PECVD a-SiOxNy:H and a-SiOx:H Coated on Polymer Resins: A Neutron Reflectometry Study
The uptake of water of as-deposited thin films of SiOxNy and SiOx hard coatings on epoxy polymer resin by PECVD is studied by X-ray photoelectron spectroscopy (XPS) and ToF-SIMS. The absence of a chemical composition gradient at the dielectric-resin interface suggests a rough interface between the two materials. Upon storage in a cleanroom environment for 6 months (19 °C/40% RH), the uptake of water of the polymer resin layer was observed by XPS. Additionally, ToF-SIMS depth profiling revealed significant changes in the water content at the SiOxNy-resin interface. We attribute these changes to the absorption of water diffusing through the dielectric-resin. Neutron reflectometry performed under a dry and D2O atmosphere confirms that D2O was nonreversibly absorbed in the SiOxNy-resin, but only limited moisture diffusion was observed in the SiOx-resin.