利用差分温度传感器进行片上热剖析的偏移校准方案

IF 1.2 4区 工程技术 Q4 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Analog Integrated Circuits and Signal Processing Pub Date : 2024-07-02 DOI:10.1007/s10470-024-02285-w
Mengting Yan, Marvin Onabajo
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引用次数: 0

摘要

本文介绍了一种专为热监测应用中的差分温度传感器量身定制的片上模拟校准方法。在两级高增益仪表放大器内提出了一个三步校准过程,以补偿器件失配和片上温度梯度引起的输出电压偏移。校准电路采用标准 65 纳米 CMOS 工艺设计,并进行了仿真。结果表明,校准后可实现平均值为 0.2 μV 的输入参考偏移,通过校准,标准偏差从 σ = 880.3 大大降低到 σ = 5086 μV。此外,蒙特卡罗和过程温度角模拟结果表明,所提出的模拟偏移校准方案对整个温度传感器电路的灵敏度影响微乎其微。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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An offset calibration scheme for on-chip thermal profiling with differential temperature sensors

This paper introduces an on-chip analog calibration method tailored for differential temperature sensors in thermal monitoring applications. A three-step calibration process is proposed within a two-stage high-gain instrumentation amplifier to compensate for the output voltage offset due to device mismatches and on-chip temperature gradients. The calibration circuits were designed in a standard 65 nm CMOS process for simulation. Results indicate that an input-referred offset with a mean of 0.2 μV can be achieved after calibration, through which the standard deviation is greatly reduced from σ = 880.3 to σ = 5086 μV. Furthermore, the proposed analog offset calibration scheme has negligible impact on the sensitivity of the complete temperature sensor circuit, as shown by Monte Carlo and process-temperature corner simulation results.

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来源期刊
Analog Integrated Circuits and Signal Processing
Analog Integrated Circuits and Signal Processing 工程技术-工程:电子与电气
CiteScore
0.30
自引率
7.10%
发文量
141
审稿时长
7.3 months
期刊介绍: Analog Integrated Circuits and Signal Processing is an archival peer reviewed journal dedicated to the design and application of analog, radio frequency (RF), and mixed signal integrated circuits (ICs) as well as signal processing circuits and systems. It features both new research results and tutorial views and reflects the large volume of cutting-edge research activity in the worldwide field today. A partial list of topics includes analog and mixed signal interface circuits and systems; analog and RFIC design; data converters; active-RC, switched-capacitor, and continuous-time integrated filters; mixed analog/digital VLSI systems; wireless radio transceivers; clock and data recovery circuits; and high speed optoelectronic circuits and systems.
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