Shiyuan Chu , Jinshuai Bai , Zi-Long Zhao , Yan Liu , Dan Huang , Bo Li , Qunyang Li , Xi-Qiao Feng
{"title":"薄膜-基底系统的周动力断裂分析","authors":"Shiyuan Chu , Jinshuai Bai , Zi-Long Zhao , Yan Liu , Dan Huang , Bo Li , Qunyang Li , Xi-Qiao Feng","doi":"10.1016/j.jmps.2024.105757","DOIUrl":null,"url":null,"abstract":"<div><p>When subjected to mechanical, thermal, or other loads, film–substrate systems may undergo complex cracking behaviors, which encompass film and substrate cracking, interfacial debonding, and their combinations, exhibiting rich fracture patterns, such as three-dimensional helical cracks. Identifying the mechanisms underlying these fracture phenomena may lead to more advanced strategies for technologically significant applications. In this paper, we develop an interfacial cohesive peridynamic method for fracture analysis of multiple-phase materials. Particularly, we focus on the modeling of coupled film cracking and interfacial debonding in film–substrate systems. By introducing cohesive interfacial bonds to describe the mechanical properties of the interfaces and adopting a displacement-based cohesive failure criterion, the model is able to predict the critical condition and path of interfacial crack propagation. The robustness of the interfacial cohesive peridynamic method is validated through a series of representative examples. We also demonstrate its efficacy in simulating three-dimensional cracks and identify the essential role of the interfacial energy release rate in controlling the cracking mode transition from a restricted pattern to a helical pattern. The numerical predictions of cracking paths and stress distributions agree well with the previous experimental results. This study provides a valuable tool for analyzing different cracking patterns in film–substrate systems and composite materials.</p></div>","PeriodicalId":17331,"journal":{"name":"Journal of The Mechanics and Physics of Solids","volume":null,"pages":null},"PeriodicalIF":5.0000,"publicationDate":"2024-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Peridynamic fracture analysis of film–substrate systems\",\"authors\":\"Shiyuan Chu , Jinshuai Bai , Zi-Long Zhao , Yan Liu , Dan Huang , Bo Li , Qunyang Li , Xi-Qiao Feng\",\"doi\":\"10.1016/j.jmps.2024.105757\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>When subjected to mechanical, thermal, or other loads, film–substrate systems may undergo complex cracking behaviors, which encompass film and substrate cracking, interfacial debonding, and their combinations, exhibiting rich fracture patterns, such as three-dimensional helical cracks. Identifying the mechanisms underlying these fracture phenomena may lead to more advanced strategies for technologically significant applications. In this paper, we develop an interfacial cohesive peridynamic method for fracture analysis of multiple-phase materials. Particularly, we focus on the modeling of coupled film cracking and interfacial debonding in film–substrate systems. By introducing cohesive interfacial bonds to describe the mechanical properties of the interfaces and adopting a displacement-based cohesive failure criterion, the model is able to predict the critical condition and path of interfacial crack propagation. The robustness of the interfacial cohesive peridynamic method is validated through a series of representative examples. We also demonstrate its efficacy in simulating three-dimensional cracks and identify the essential role of the interfacial energy release rate in controlling the cracking mode transition from a restricted pattern to a helical pattern. The numerical predictions of cracking paths and stress distributions agree well with the previous experimental results. This study provides a valuable tool for analyzing different cracking patterns in film–substrate systems and composite materials.</p></div>\",\"PeriodicalId\":17331,\"journal\":{\"name\":\"Journal of The Mechanics and Physics of Solids\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":5.0000,\"publicationDate\":\"2024-06-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of The Mechanics and Physics of Solids\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0022509624002230\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of The Mechanics and Physics of Solids","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0022509624002230","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Peridynamic fracture analysis of film–substrate systems
When subjected to mechanical, thermal, or other loads, film–substrate systems may undergo complex cracking behaviors, which encompass film and substrate cracking, interfacial debonding, and their combinations, exhibiting rich fracture patterns, such as three-dimensional helical cracks. Identifying the mechanisms underlying these fracture phenomena may lead to more advanced strategies for technologically significant applications. In this paper, we develop an interfacial cohesive peridynamic method for fracture analysis of multiple-phase materials. Particularly, we focus on the modeling of coupled film cracking and interfacial debonding in film–substrate systems. By introducing cohesive interfacial bonds to describe the mechanical properties of the interfaces and adopting a displacement-based cohesive failure criterion, the model is able to predict the critical condition and path of interfacial crack propagation. The robustness of the interfacial cohesive peridynamic method is validated through a series of representative examples. We also demonstrate its efficacy in simulating three-dimensional cracks and identify the essential role of the interfacial energy release rate in controlling the cracking mode transition from a restricted pattern to a helical pattern. The numerical predictions of cracking paths and stress distributions agree well with the previous experimental results. This study provides a valuable tool for analyzing different cracking patterns in film–substrate systems and composite materials.
期刊介绍:
The aim of Journal of The Mechanics and Physics of Solids is to publish research of the highest quality and of lasting significance on the mechanics of solids. The scope is broad, from fundamental concepts in mechanics to the analysis of novel phenomena and applications. Solids are interpreted broadly to include both hard and soft materials as well as natural and synthetic structures. The approach can be theoretical, experimental or computational.This research activity sits within engineering science and the allied areas of applied mathematics, materials science, bio-mechanics, applied physics, and geophysics.
The Journal was founded in 1952 by Rodney Hill, who was its Editor-in-Chief until 1968. The topics of interest to the Journal evolve with developments in the subject but its basic ethos remains the same: to publish research of the highest quality relating to the mechanics of solids. Thus, emphasis is placed on the development of fundamental concepts of mechanics and novel applications of these concepts based on theoretical, experimental or computational approaches, drawing upon the various branches of engineering science and the allied areas within applied mathematics, materials science, structural engineering, applied physics, and geophysics.
The main purpose of the Journal is to foster scientific understanding of the processes of deformation and mechanical failure of all solid materials, both technological and natural, and the connections between these processes and their underlying physical mechanisms. In this sense, the content of the Journal should reflect the current state of the discipline in analysis, experimental observation, and numerical simulation. In the interest of achieving this goal, authors are encouraged to consider the significance of their contributions for the field of mechanics and the implications of their results, in addition to describing the details of their work.