{"title":"致谢","authors":"","doi":"10.1088/1757-899x/1302/1/011005","DOIUrl":null,"url":null,"abstract":"The CEC and ICMC Boards wish to thank our supporters and sponsors who have contributed to the 2023 CEC/ICMC Conference.<bold>CONFERENCE SPONSORS AND ADVERTISERS</bold><bold>• Aerospace Fabrication and Materials</bold><bold>• Cryofab, Inc</bold><bold>• Cryogenic US LLC</bold><bold>• Cryomech, Inc</bold><bold>• Danaher Cryogenics LTD</bold><bold>• FAMU-FSU College of Engineering</bold><bold>• GenH2</bold><bold>• ICEoxford</bold><bold>• National High Magnetic Field Laboratory</bold><bold>• Scientific Instruments</bold><bold>• Sumitomo (SHI) Cryogenics of America, Inc.</bold><bold>• Texas Center for Superconductivity at the University of Houston</bold><bold>EXHIBITORS</bold><bold>• Ability Engineering Technology, Inc.</bold><bold>• Aerospace Fabrication and Materials</bold><bold>• Air Liquide Advanced Technologies</bold><bold>• attocube systems Inc.</bold><bold>• Barber-Nichols</bold><bold>• Celadon Systems Inc.</bold><bold>• Cryofab, Inc.</bold><bold>• Cryomagnetics, Inc.</bold><bold>• Cryomech, Inc.</bold><bold>• CryoTechnics</bold><bold>• CryoWorks</bold><bold>• Cryoworld BV</bold><bold>• Danaher Cryogenics LTD</bold><bold>• FABRUM</bold><bold>• FormFactor Inc.</bold><bold>• Fujikura Ltd.</bold><bold>• Honeywell</bold><bold>• Hyper Tech</bold><bold>• ICEoxford</bold><bold>• Iris Technologies</bold><bold>• Lake Shore Cryotronics</bold><bold>• Lihan Cryogenics Co., Ltd.</bold><bold>• Linde Kryotechnik AG</bold><bold>• Omegaflex</bold><bold>• Ratheon Technologies Research Center</bold><bold>• Scientific Instruments</bold><bold>• Stöhr Armaturen GmbH & Co.KG</bold><bold>• Sumitomo (SHI) Cryogenics of America, Inc.</bold><bold>• Sunpower, Inc.</bold><bold>• Vacree Technologies Co., Ltd.</bold><bold>• WSU HYPER Lab</bold>Producing the <bold>Open Access <italic toggle=\"yes\">IOP Conference Series: Materials Science and Engineering (MSE)</italic>\n</bold> requires the dedicated effort of many individuals. The quality of the publication relies on the dedication of those who took time from their busy schedules to review and edit papers. The Boards wish to specifically acknowledge the efforts of Centennial Conferences for their editorial support, and the chief technical editors, John Weisend (CEC) and Balu Balachandran (ICMC). Their contributions to ensure a quality publication in a timely manner are greatly appreciated. The chief technical editors are indebted to the individual technical sub-editors for their time spent with reviewers and authors to get the final manuscripts ready for publication. The Boards also wish to thank all students and post-doctoral researchers from a number of universities for their service with the initial format checking of the papers submitted for peer review.CEC/ICMC 2023 was managed by Paula Pair and Centennial Conferences. Recognizing this is a tremendous team effort, the Boards would especially acknowledge, in addition to Paula, all her staff – Annett Cady, Andrea and Paul Crangle, Brion Jacobs, Andrew Kahl, Carrie Lian, Katherine Neilson, Alicia Orcutt, Sydney Pair, and Christina Tomhave – for the fantastic job they did wonderfully.We also would like to recognize the effort and dedication of the attendees in preparing their presentations and papers, and showing the professionalism and enthusiasm that makes the CEC/ICMC such a great Conference time after time.","PeriodicalId":14483,"journal":{"name":"IOP Conference Series: Materials Science and Engineering","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2024-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Acknowledgments\",\"authors\":\"\",\"doi\":\"10.1088/1757-899x/1302/1/011005\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The CEC and ICMC Boards wish to thank our supporters and sponsors who have contributed to the 2023 CEC/ICMC Conference.<bold>CONFERENCE SPONSORS AND ADVERTISERS</bold><bold>• Aerospace Fabrication and Materials</bold><bold>• Cryofab, Inc</bold><bold>• Cryogenic US LLC</bold><bold>• Cryomech, Inc</bold><bold>• Danaher Cryogenics LTD</bold><bold>• FAMU-FSU College of Engineering</bold><bold>• GenH2</bold><bold>• ICEoxford</bold><bold>• National High Magnetic Field Laboratory</bold><bold>• Scientific Instruments</bold><bold>• Sumitomo (SHI) Cryogenics of America, Inc.</bold><bold>• Texas Center for Superconductivity at the University of Houston</bold><bold>EXHIBITORS</bold><bold>• Ability Engineering Technology, Inc.</bold><bold>• Aerospace Fabrication and Materials</bold><bold>• Air Liquide Advanced Technologies</bold><bold>• attocube systems Inc.</bold><bold>• Barber-Nichols</bold><bold>• Celadon Systems Inc.</bold><bold>• Cryofab, Inc.</bold><bold>• Cryomagnetics, Inc.</bold><bold>• Cryomech, Inc.</bold><bold>• CryoTechnics</bold><bold>• CryoWorks</bold><bold>• Cryoworld BV</bold><bold>• Danaher Cryogenics LTD</bold><bold>• FABRUM</bold><bold>• FormFactor Inc.</bold><bold>• Fujikura Ltd.</bold><bold>• Honeywell</bold><bold>• Hyper Tech</bold><bold>• ICEoxford</bold><bold>• Iris Technologies</bold><bold>• Lake Shore Cryotronics</bold><bold>• Lihan Cryogenics Co., Ltd.</bold><bold>• Linde Kryotechnik AG</bold><bold>• Omegaflex</bold><bold>• Ratheon Technologies Research Center</bold><bold>• Scientific Instruments</bold><bold>• Stöhr Armaturen GmbH & Co.KG</bold><bold>• Sumitomo (SHI) Cryogenics of America, Inc.</bold><bold>• Sunpower, Inc.</bold><bold>• Vacree Technologies Co., Ltd.</bold><bold>• WSU HYPER Lab</bold>Producing the <bold>Open Access <italic toggle=\\\"yes\\\">IOP Conference Series: Materials Science and Engineering (MSE)</italic>\\n</bold> requires the dedicated effort of many individuals. The quality of the publication relies on the dedication of those who took time from their busy schedules to review and edit papers. The Boards wish to specifically acknowledge the efforts of Centennial Conferences for their editorial support, and the chief technical editors, John Weisend (CEC) and Balu Balachandran (ICMC). Their contributions to ensure a quality publication in a timely manner are greatly appreciated. The chief technical editors are indebted to the individual technical sub-editors for their time spent with reviewers and authors to get the final manuscripts ready for publication. The Boards also wish to thank all students and post-doctoral researchers from a number of universities for their service with the initial format checking of the papers submitted for peer review.CEC/ICMC 2023 was managed by Paula Pair and Centennial Conferences. Recognizing this is a tremendous team effort, the Boards would especially acknowledge, in addition to Paula, all her staff – Annett Cady, Andrea and Paul Crangle, Brion Jacobs, Andrew Kahl, Carrie Lian, Katherine Neilson, Alicia Orcutt, Sydney Pair, and Christina Tomhave – for the fantastic job they did wonderfully.We also would like to recognize the effort and dedication of the attendees in preparing their presentations and papers, and showing the professionalism and enthusiasm that makes the CEC/ICMC such a great Conference time after time.\",\"PeriodicalId\":14483,\"journal\":{\"name\":\"IOP Conference Series: Materials Science and Engineering\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2024-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IOP Conference Series: Materials Science and Engineering\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1088/1757-899x/1302/1/011005\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IOP Conference Series: Materials Science and Engineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1088/1757-899x/1302/1/011005","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
摘要
会议赞助商和广告商- Aerospace Fabrication and Materials- Cryofab, Inc- Cryogenic US LLC- Cryomech, Inc- Danaher Cryogenics LTD- FAMU-FSU College of Engineering- GenH2- ICEoxford- National High Magnetic Field Laboratory- Scientific Instruments- Sumitomo (SHI) Cryogenics of America, Inc.- 德克萨斯州休斯顿大学超导中心EXHIBITORS- Ability Engineering Technology, Inc.- Aerospace Fabrication and Materials- Air Liquide Advanced Technologies- attocube systems Inc.- Barber-Nichols- Celadon Systems Inc.- Cryofab, Inc.- Cryomagnetics, Inc.- Cryomech, Inc.- CryoTechnics- CryoWorks- Cryoworld BV- Danaher Cryogenics LTD- FABRUM- FormFactor Inc.- Fujikura Ltd.- Honeywell- Hyper Tech- ICEoxford- Iris Technologies- Lake Shore Cryotronics- Lihan Cryogenics Co、Ltd.- Linde Kryotechnik AG- Omegaflex- Ratheon Technologies Research Center- Scientific Instruments- Stöhr Armaturen GmbH & Co.KG- Sumitomo (SHI) Cryogenics of America, Inc.- Sunpower, Inc.- Vacree Technologies Co., Ltd.- WSU HYPER LabProducing the Open Access IOP Conference Series:IOP Conference Series: Materials Science and Engineering (MSE) 的出版需要许多人的不懈努力。出版物的质量有赖于那些在百忙之中抽出时间审阅和编辑论文的人。在此,理事会特别感谢 Centennial Conferences 提供的编辑支持,以及技术主编 John Weisend(CEC)和 Balu Balachandran(ICMC)。我们非常感谢他们为确保及时出版高质量的出版物所做的贡献。技术主编们还要感谢各位技术副主编,感谢他们花费大量时间与审稿人和作者一起为最终稿件的出版做准备。董事会还要感谢来自多所大学的所有学生和博士后研究人员,感谢他们对提交同行评审的论文进行初步格式检查。董事会认识到这是一项巨大的团队工作,除Paula外,还要特别感谢她的所有工作人员--Annett Cady、Andrea and Paul Crangle、Brion Jacobs、Andrew Kahl、Carrie Lian、Katherine Neilson、Alicia Orcutt、Sydney Pair和Christina Tomhave--感谢他们出色地完成了工作。我们还要感谢与会者在准备演讲和论文时所付出的努力和奉献,他们所表现出的专业精神和热情使 CEC/ICMC 一次又一次地成为如此精彩的会议。
The CEC and ICMC Boards wish to thank our supporters and sponsors who have contributed to the 2023 CEC/ICMC Conference.CONFERENCE SPONSORS AND ADVERTISERS• Aerospace Fabrication and Materials• Cryofab, Inc• Cryogenic US LLC• Cryomech, Inc• Danaher Cryogenics LTD• FAMU-FSU College of Engineering• GenH2• ICEoxford• National High Magnetic Field Laboratory• Scientific Instruments• Sumitomo (SHI) Cryogenics of America, Inc.• Texas Center for Superconductivity at the University of HoustonEXHIBITORS• Ability Engineering Technology, Inc.• Aerospace Fabrication and Materials• Air Liquide Advanced Technologies• attocube systems Inc.• Barber-Nichols• Celadon Systems Inc.• Cryofab, Inc.• Cryomagnetics, Inc.• Cryomech, Inc.• CryoTechnics• CryoWorks• Cryoworld BV• Danaher Cryogenics LTD• FABRUM• FormFactor Inc.• Fujikura Ltd.• Honeywell• Hyper Tech• ICEoxford• Iris Technologies• Lake Shore Cryotronics• Lihan Cryogenics Co., Ltd.• Linde Kryotechnik AG• Omegaflex• Ratheon Technologies Research Center• Scientific Instruments• Stöhr Armaturen GmbH & Co.KG• Sumitomo (SHI) Cryogenics of America, Inc.• Sunpower, Inc.• Vacree Technologies Co., Ltd.• WSU HYPER LabProducing the Open Access IOP Conference Series: Materials Science and Engineering (MSE) requires the dedicated effort of many individuals. The quality of the publication relies on the dedication of those who took time from their busy schedules to review and edit papers. The Boards wish to specifically acknowledge the efforts of Centennial Conferences for their editorial support, and the chief technical editors, John Weisend (CEC) and Balu Balachandran (ICMC). Their contributions to ensure a quality publication in a timely manner are greatly appreciated. The chief technical editors are indebted to the individual technical sub-editors for their time spent with reviewers and authors to get the final manuscripts ready for publication. The Boards also wish to thank all students and post-doctoral researchers from a number of universities for their service with the initial format checking of the papers submitted for peer review.CEC/ICMC 2023 was managed by Paula Pair and Centennial Conferences. Recognizing this is a tremendous team effort, the Boards would especially acknowledge, in addition to Paula, all her staff – Annett Cady, Andrea and Paul Crangle, Brion Jacobs, Andrew Kahl, Carrie Lian, Katherine Neilson, Alicia Orcutt, Sydney Pair, and Christina Tomhave – for the fantastic job they did wonderfully.We also would like to recognize the effort and dedication of the attendees in preparing their presentations and papers, and showing the professionalism and enthusiasm that makes the CEC/ICMC such a great Conference time after time.