基于多层无芯 ABF 基板的 94 千兆赫双极化一维串联馈电相控阵天线,具有低侧扰水平

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-07-16 DOI:10.1109/TCPMT.2024.3429168
Ding Wang;Chen Hui Xia;Yong Fan;Yu Jian Cheng
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引用次数: 0

摘要

本文介绍了一种 94 GHz 双偏振一维波束成形贴片天线阵列,该阵列专门设计用于实现低侧叶水平(SLL)和大扫描范围。该阵列采用 $4\times 8$ 配置,能够进行 1-D 扩展,并使用了 Ajinomoto build-up film (ABF) 衬底和精密电镀工艺。这种组合确保了高精度,并满足了 94 GHz 操作的小型化要求。这项研究的一项显著成果是利用短端耦合线设计出了紧凑型功率分配器,从而实现了较大的功率分配比例。这种设计对于在 1/times 8$ 线性阵列内的 92/sim 96$ -GHz 带宽上保持稳定的低 SLL(通常低于 -18.2 dB,经常低于 -20 dB)至关重要。此外,阵列的横向剖面通过改变馈电角进行了优化,将线性阵列之间的距离减小到 0.52 (lambda _{0}$),其中 $ (lambda _{0}$)表示 94 GHz 时的自由空间波长。所提出的 $4\times 8$ 阵列设计可实现高达 ±45° 的光束转向,且不会产生光栅裂纹。双极化阵列天线在 94.0 GHz 下的构建和实验验证了其有效性,证实了在两个极化下均能实现低 SLL 和广泛的扫描能力。
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A 94-GHz Dual-Polarized 1-D Series-Fed Phased Array Antenna With Low Sidelobe Level Based on Multilayer Coreless ABF Substrates
This article introduces a 94-GHz dual-polarized 1-D beamforming patch antenna array, specifically designed to achieve low sidelobe levels (SLLs) and an extensive scanning range. The array, in a $4\times 8$ configuration, is capable of 1-D expansion and utilizes Ajinomoto build-up film (ABF) substrates alongside a precision electroplating process. This combination ensures high accuracy and fulfills the miniaturization demands for 94-GHz operations. A notable achievement of this research is the design of a compact power divider using a coupling line with short end, which establishes a large power dividing ratio. This design is pivotal in maintaining consistently low SLLs, typically below −18.2 dB and often below −20 dB, over the $92\sim 96$ -GHz bandwidth within a $1\times 8$ linear array. In addition, the array’s transverse profile is optimized by altering the feeder angle, decreasing the distance between linear arrays to $0.52\lambda _{0}$ , where $\lambda _{0}$ denotes the free-space wavelength at 94 GHz. The proposed $4\times 8$ array design facilitates beam steering up to ±45° without grating lobes. The construction and experiments of the dual-polarized array antenna at 94.0 GHz validate its effectiveness, confirming the achievement of low SLL and extensive scanning capabilities in both polarizations.
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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