利用两种保持电压改进方法协同设计 5 V ESD 保护应用

IF 1.9 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronics Journal Pub Date : 2024-07-17 DOI:10.1016/j.mejo.2024.106348
{"title":"利用两种保持电压改进方法协同设计 5 V ESD 保护应用","authors":"","doi":"10.1016/j.mejo.2024.106348","DOIUrl":null,"url":null,"abstract":"<div><p>In this paper, a series of Low Voltage Triggering Silicon-Controlled Rectifier (LVTSCR)-based devices were designed and fabricated in a 0.25 μm Bipolar-CMOS-DMOS (BCD) process. Two distinct methods, the integration of additional doping regions and current paths, are investigated to improve the proposed devices’ holding voltage (V<sub>h</sub>). Two-dimensional device simulation is employed to elucidate the working mechanism of these ESD protection devices, complemented by the introduction of a transmission line pulse (TLP) measuring system to assess their ESD protection capabilities. Comparative analysis of TLP results reveals that both methods contribute significantly to the augmentation of holding voltage in LVTSCR ESD protection devices. The refined structure, LVTSCR_BN, with two additional current paths, surface and buried, demonstrated a noticeable increment in holding voltage. With its holding voltage of 7.619 V and trigger voltage of 10.61 V, LVTSCR_BN is proved suitable for the ESD protection of circuits operating at the voltage of 5 V.</p></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":null,"pages":null},"PeriodicalIF":1.9000,"publicationDate":"2024-07-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The synergistic design of 5 V ESD protection applications using two holding voltage improving methods\",\"authors\":\"\",\"doi\":\"10.1016/j.mejo.2024.106348\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>In this paper, a series of Low Voltage Triggering Silicon-Controlled Rectifier (LVTSCR)-based devices were designed and fabricated in a 0.25 μm Bipolar-CMOS-DMOS (BCD) process. Two distinct methods, the integration of additional doping regions and current paths, are investigated to improve the proposed devices’ holding voltage (V<sub>h</sub>). Two-dimensional device simulation is employed to elucidate the working mechanism of these ESD protection devices, complemented by the introduction of a transmission line pulse (TLP) measuring system to assess their ESD protection capabilities. Comparative analysis of TLP results reveals that both methods contribute significantly to the augmentation of holding voltage in LVTSCR ESD protection devices. The refined structure, LVTSCR_BN, with two additional current paths, surface and buried, demonstrated a noticeable increment in holding voltage. With its holding voltage of 7.619 V and trigger voltage of 10.61 V, LVTSCR_BN is proved suitable for the ESD protection of circuits operating at the voltage of 5 V.</p></div>\",\"PeriodicalId\":49818,\"journal\":{\"name\":\"Microelectronics Journal\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":1.9000,\"publicationDate\":\"2024-07-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronics Journal\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1879239124000523\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Journal","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1879239124000523","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

本文采用 0.25 μm 双极-CMOS-DMOS(BCD)工艺设计并制造了一系列基于低电压触发硅控整流器(LVTSCR)的器件。研究了集成额外掺杂区和电流通路这两种不同的方法,以提高拟议器件的保持电压 (Vh)。采用二维器件仿真来阐明这些 ESD 保护器件的工作机制,并辅以引入传输线脉冲 (TLP) 测量系统来评估其 ESD 保护能力。对 TLP 结果的比较分析表明,这两种方法都能显著提高 LVTSCR ESD 保护装置的保持电压。改进后的 LVTSCR_BN 结构增加了表面和埋入两个电流路径,显著提高了保持电压。LVTSCR_BN 的保持电压为 7.619 V,触发电压为 10.61 V,被证明适用于工作电压为 5 V 的电路的 ESD 保护。
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The synergistic design of 5 V ESD protection applications using two holding voltage improving methods

In this paper, a series of Low Voltage Triggering Silicon-Controlled Rectifier (LVTSCR)-based devices were designed and fabricated in a 0.25 μm Bipolar-CMOS-DMOS (BCD) process. Two distinct methods, the integration of additional doping regions and current paths, are investigated to improve the proposed devices’ holding voltage (Vh). Two-dimensional device simulation is employed to elucidate the working mechanism of these ESD protection devices, complemented by the introduction of a transmission line pulse (TLP) measuring system to assess their ESD protection capabilities. Comparative analysis of TLP results reveals that both methods contribute significantly to the augmentation of holding voltage in LVTSCR ESD protection devices. The refined structure, LVTSCR_BN, with two additional current paths, surface and buried, demonstrated a noticeable increment in holding voltage. With its holding voltage of 7.619 V and trigger voltage of 10.61 V, LVTSCR_BN is proved suitable for the ESD protection of circuits operating at the voltage of 5 V.

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来源期刊
Microelectronics Journal
Microelectronics Journal 工程技术-工程:电子与电气
CiteScore
4.00
自引率
27.30%
发文量
222
审稿时长
43 days
期刊介绍: Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.
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