基于电化学增材制造的单相自然对流浸入式冷却应用散热器设计

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Packaging Pub Date : 2024-07-18 DOI:10.1115/1.4065987
Jacob Lamotte-Dawaghreh, Joseph Herring, S. Pundla, Rohit Suthar, Vivek Nair, P. Bansode, Gautam Gupta, D. Agonafer, Joseph Madril, Tim Ouradnik, Michael Matthews, Ian Winfield
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引用次数: 0

摘要

为了满足现代数据中心日益增长的数据处理需求,必须相应提高服务器的性能。由于高性能处理单元的存在,服务器的耗电量和发热量也随之增加。目前,风冷是数据中心使用最广泛的热管理技术,但它在冷却高功率密度封装时已开始受到限制。因此,使用数据中心的行业正在寻求单相浸入式冷却,通过加强服务器的热管理来降低运行和冷却成本。本研究设计了具有三周期最小表面晶格结构的散热器,用于数据中心服务器的单相浸入式冷却。由于拓扑结构复杂,电化学快速成型制造技术使这些设计成为可能。电化学快速成型制造工艺可以生成复杂的散热器几何形状,而传统制造工艺则无法实现。几何结构复杂,包括非晶和多孔结构,表面积与体积比高,使电化学增材制造散热器具有卓越的传热性能。我们的目标是在自然对流设置的单相浸入式冷却设置中,通过最大限度降低外壳温度来比较各种散热器几何形状。ANSYS Fluent 中的计算流体动力学被用来比较电化学快速成型散热器设计。通过比较它们在自然对流条件下的热性能,对增材制造散热器设计进行了评估。这项研究提出了一种新颖的散热器设计方法,并提高了电化学快速成型制造散热器的能力。
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Electrochemical Additive Manufacturing Based Design of a Heat Sink for Single Phase Natural Convection Immersion Cooling Application
To fulfill the increasing data processing demands within modern data centers, a corresponding increase in server performance is necessary. This leads to subsequent increases in power consumption and heat generation in the servers due to high performance processing units. Currently, air cooling is the most widely used thermal management technique in data centers, but it has started to reach its limitations in cooling of high-power density packaging. Therefore, industries utilizing data centers are looking to single-phase immersion cooling to reduce the operational and cooling costs by enhancing the thermal management of servers. In this study, heat sinks with triply periodic minimal surface lattice structures were designed for application in single-phase immersion cooling of data center servers. These designs are made possible by Electrochemical Additive Manufacturing technology due to their complex topologies. The Electrochemical Additive Manufacturing process allows for generation of complex heat sink geometries not possible using traditional manufacturing processes. Geometric complexities including amorphous and porous structures with high surface area to volume ratio enable Electrochemical Additive Manufacturing heat sinks to have superior heat transfer properties. Our objective is to compare various heat sink geometries by minimizing max case temperature in a single-phase immersion cooling setup for a natural convection setup. Computational fluid dynamics in ANSYS Fluent is utilized to compare the Electrochemical Additive Manufacturing heat sink designs. The additively manufactured heat sink designs are evaluated by comparing their thermal performance under natural convection conditions. This study presents a novel approach to heat sink design and bolsters the capability of Electrochemical Additive Manufacturing-produced heat sinks.
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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