L2A Cdus 性能和使用传统空调升级服务器机房的考虑因素

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Packaging Pub Date : 2024-07-17 DOI:10.1115/1.4065942
Ali Heydari, Qusai Soud, Mohammad Tradat, Ahmad R. Gharaibeh, Najmeh Fallahtafti, Jeremy Rodriguez, Bahgat Sammakia
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引用次数: 0

摘要

随着基于网络的人工智能应用的快速增长,机房面临着不断升级的计算需求,这促使企业要么升级其设施,要么将其外包到共用地点。这种增长对传统的暖通空调系统造成了压力,因为传统系统难以应对巨大的热负荷,往往会产生热点。液-气(L2A)冷却液分配装置(CDU)作为一种解决方案应运而生,它通过安装在每块服务器板上的冷却回路循环液态冷却液,有效地冷却服务器。本研究评估了 24 千瓦 L2A CDU 在各种情况下的性能,重点关注冷却效果、稳定性和可靠性。实验测试包括一个带有三个热测试车(TTV)的机架,对液体冷却剂和空气两侧进行监测分析。测试在有限的空调环境中进行,类似于使用传统空调系统的升级版服务器机房。研究还评估了高功率密度冷却装置对机房环境的影响,并根据 ASHRAE 人体舒适度标准测量了噪音、风速和环境温度。研究还提出了最佳实践和潜在系统改进建议,以满足在计算需求不断升级的情况下对高效冷却解决方案日益增长的需求。
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L2A Cdus Performance and Considerations for Server Rooms Upgrade with Conventional Air Conditioning
As web-based AI applications are growing rapidly, server rooms face escalating computational demands, prompting enterprises to either upgrade their facilities or outsource to co-located sites. This growth strains conventional HVAC systems, which struggle to handle the substantial thermal load, often resulting in hotspots. Liquid-to-Air (L2A) Coolant Distribution Units (CDUs) emerge as a solution, efficiently cooling servers by circulating liquid coolant through cooling loops mounted on each server board. In this study, the performance of a 24-kW L2A CDU is evaluated across various scenarios, emphasizing cooling effect, stability, and reliability. Experimental tests involve a rack with three thermal test vehicles (TTVs), monitoring both liquid coolant and air sides for analysis. Tests are conducted in a limited air-conditioned environment, resembling upgraded server rooms with conventional AC systems. The study also assesses the impact of high-power density cooling units on the server room environment, measuring noise, air velocity, and ambient temperature against ASHRAE standards for human comfort. Recommendations for optimal practices and potential system improvements are included in the research, addressing the growing need for efficient cooling solutions amidst escalating computational demands.
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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