对流冷却在深空运行的电力电子设备

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Packaging Pub Date : 2024-07-17 DOI:10.1115/1.4065947
Jessica Harsono, Joseph P. Kozak, Hala Tomey, William Yerkes, Jonathan Neville
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引用次数: 0

摘要

由于大多数传统航天器的设计都是在真空环境中运行,因此强制对流冷却在太空应用中的使用非常有限。本文考虑了一个理想的候选方案--蜻蜓着陆器,这是一种被送入深空在土星最大的卫星土卫六上进行实验的旋翼机。本文针对旋翼驱动电子设备(RDE)单元提出了一种基于强制对流的热管理解决方案,该单元是一个大功率电子盒,负责控制旋翼,使着陆器能够在土卫六上飞行。在 Solidworks Flow Simulation 中建立了一个热流模型,以评估集成到封装设计中并用作 RDE 冷却主要方法的风扇系统的有效性。该模型通过定制设计的地面支持设备收集的温度数据进行了验证。结果发现,在仅靠传导和辐射传热无法满足要求的情况下,利用强制对流可以使密封包装的 RDE 内电子设备的温度保持在运行极限之内。与地球相比,土卫六的稠密大气导致通过风扇的质量流量更大,因此强制对流是一种特别有效的热传递方法。这项研究可为在未来的太空任务或非传统环境中使用强制对流提供指导。
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Convection Cooling of Power Electronics Operating in Deep-Space
Since most traditional spacecraft are designed to operate in a vacuum environment, forced convection cooling has seen limited use in space-applications. This paper considers an ideal candidate–the Dragonfly Lander, a rotorcraft being sent into Deep-space to conduct experiments on Saturn's largest moon, Titan. A forced convection based thermal management solution is presented for the Rotor Drive Electronics (RDE) unit, a high-power electronics box responsible for controlling the rotors that allow the Lander to fly on Titan. A thermal flow model was built in Solidworks Flow Simulation to evaluate the effectiveness of a fan system integrated into the packaging design and used as the primary method for cooling the RDE. The model was validated with temperature data collected from custom designed ground support equipment. It was found that utilizing forced convection allows temperatures of the electronics within the tightly packaged RDE to remain within operational limits when conductive and radiative heat transfer alone are insufficient. Titan's dense atmosphere results in greater mass flow rates through fans compared to on Earth, making forced convection a particularly efficient method of heat transfer. This research may guide the use of forced convection in future space missions, or non-traditional environments.
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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